Uncooled infrared detector and pixel-level packaging structure thereof

Abstract

The invention relates to a pixel-level packaging structure comprising a micro-cavity arranged on an infrared CMOS reading circuit; the micro-cavity comprises a first-layer vacuum space for placing a packaging part and a second-layer vacuum space arranged on the first-layer vacuum space; and a first exhaust hole is formed in the cavity wall between the first-layer vacuum space and the second-layervacuum space, two second exhaust holes are formed in the side, away from the first-layer vacuum space, of the second-layer vacuum space, and the first exhaust hole communicates with the two second exhaust holes. The invention further provides an uncooled infrared detector; the uncooled infrared detector further comprises the pixel-level packaging structure, and the micro-cavity is arranged on an infrared CMOS reading circuit. The first exhaust hole and the two second exhaust holes are formed, the three exhaust holes are combined to form a Y-shaped structure, the hole sealing difficulty can begreatly reduced, and thus the hole filling uniformity within the whole 8-inch range is improved, and the overall performance uniformity of the detector is greatly improved.

Description

technical field [0001] The invention relates to the technical field of pixel-level packaging, in particular to an uncooled infrared detector and a pixel-level packaging structure thereof. Background technique [0002] At present, uncooled infrared mostly adopts packaging technology, which can be divided into chip level, wafer level and pixel level, etc. Among them, chip level packaging technology can be divided into metal tube package and ceramic tube package according to the difference of package shell. [0003] Metal shell packaging is the earliest packaging technology adopted, and the technology is very mature. Due to the use of high-cost components such as metal case, TEC and getter, the cost of metal case packaging has been high, which limits its application to low-cost devices. [0004] The ceramic shell package can significantly reduce the volume and weight of the packaged detector, and it is much lower than the traditional metal shell package in terms of raw materia...

AI Technical Summary

Problems solved by technology

However, the existing pixel-level packaging technology has a lot of difficulty in sealing the vent hole, because the difficulty of pixel-level packaging lies in how to seal the vent hole in a high vacuum environment and how to ensure the uniformity of the sealing hole and consistency, because only by ensuring the uniformity of the sealing hole can the consistency of the detector responsivity be guaranteed, and if the sealing hole is uneven, it will affect the overall performance of the detector

In addition, the detector uses a getter to absorb air in the vacuum space. However, the existing getters are placed in various positions, but they cannot achieve the best air-intake effect.

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