Uncooled infrared detector and its pixel-level packaging structure

Abstract

The invention relates to a pixel-level packaging structure, which includes a microcavity arranged on an infrared CMOS readout circuit, the microcavity includes a first layer of vacuum space for packaging components and a vacuum space on the first layer of vacuum space. The second layer of vacuum space; a first exhaust hole is opened on the cavity wall between the first layer of vacuum space and the second layer of vacuum space, and the second layer of vacuum space is far away from the first layer of vacuum space Two second exhaust holes are opened on one side, and the first exhaust hole communicates with the two second exhaust holes. An uncooled infrared detector is also provided, which further includes the above-mentioned pixel-level packaging structure, and the microcavity is arranged on the infrared CMOS readout circuit. In the present invention, by setting the first vent hole and two second vent holes, the three vent holes are combined to form a Y-shaped structure, which can greatly reduce the difficulty of sealing holes, thereby improving the efficiency of filling holes within the entire 8-inch range. The uniformity greatly improves the overall uniformity of the detector performance.

Description

technical field [0001] The invention relates to the technical field of pixel-level packaging, in particular to an uncooled infrared detector and a pixel-level packaging structure thereof. Background technique [0002] At present, uncooled infrared mostly adopts packaging technology, which can be divided into chip level, wafer level and pixel level, etc. Among them, chip level packaging technology can be divided into metal tube package and ceramic tube package according to the difference of package shell. [0003] Metal shell packaging is the earliest packaging technology adopted, and the technology is very mature. Due to the use of high-cost components such as metal case, TEC and getter, the cost of metal case packaging has been high, which limits its application to low-cost devices. [0004] The ceramic shell package can significantly reduce the volume and weight of the packaged detector, and it is much lower than the traditional metal shell package in terms of raw materia...

AI Technical Summary

Problems solved by technology

However, the existing pixel-level packaging technology has a lot of difficulty in sealing the vent hole, because the difficulty of pixel-level packaging lies in how to seal the vent hole in a high vacuum environment and how to ensure the uniformity of the sealing hole and consistency, because only by ensuring the uniformity of the sealing hole can the consistency of the detector responsivity be guaranteed, and if the sealing hole is uneven, it will affect the overall performance of the detector

In addition, the detector uses a getter to absorb air in the vacuum space. However, the existing getters are placed in various positions, but they cannot achieve the best air-intake effect.

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