Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Mechanical arm and wafer grabbing device

A robotic arm, wafer technology, applied in conveyor objects, transportation and packaging, electrical components, etc., can solve problems such as grasping failure and reducing production efficiency

Inactive Publication Date: 2021-03-23
YANGTZE MEMORY TECH CO LTD
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The robotic arm must carry out the grabbing operation when handling the wafer. During the process of grabbing the wafer, the deviation between the wafer and the robotic arm will cause grabbing failure and reduce production efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mechanical arm and wafer grabbing device
  • Mechanical arm and wafer grabbing device
  • Mechanical arm and wafer grabbing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0032] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0033] As described in the background art, when the robotic arm is carrying the wafer, it must carry out the grabbing operation, and the deviation between the wafer and the robotic arm during the wafer grabbing process will cause grabbing failure and reduce production efficiency.

[0034] Whether the robot arm ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a mechanical arm and a wafer grabbing device. The mechanical arm comprises a mechanical arm body which comprises a main body part and two fork arm parts, and the main body partis provided with a first fixing part. The tail end of each fork arm part is provided with a second supporting part and a second fixing part, and a height difference exists between the second fixing part and the second supporting part, so that the second fixing part and the first fixing part are enabled to fix the wafer; and the upper surface of the second supporting part inclines towards one sidesurface in the height extension direction of the second fixing part, so that the wafer gradually moves to the top of the second supporting part along the upper surface inclining towards one side surface, and the movement path of the wafer is prevented from deviating. Moreover, the second fixing part and the second supporting part have a certain height difference, so that the second fixing part caneffectively block the wafer and fix the wafer with the first fixing part, the wafer is prevented from moving out of the fork arm part in the moving process, and the grabbing success rate of the waferis increased.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a mechanical arm and a wafer grabbing device. Background technique [0002] In the manufacturing process of semiconductor integrated circuits, it is often necessary to carry out wafer handling by robotic arms. There are two types of wafer handling manipulators in the wafer processing system: atmospheric manipulator (FI robot) and vacuum manipulator (Vacuum robot). The former removes wafers from cassettes and places them on pre-alignment equipment. The latter removes the wafer from the pre-alignment equipment, transports it to each station for etching and other process processing, and transports the processed wafer to the interface position, waiting for the atmospheric manipulator to put it back into the wafer box. [0003] The robotic arm must carry out the grabbing operation when handling the wafer. During the process of grabbing the wafer, the deviation between the w...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/677
CPCH01L21/67706H01L21/67742H01L21/67796
Inventor 陈炤颖雷少君胡聪卢山
Owner YANGTZE MEMORY TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com