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Communication control circuit applied to power supply chip

A communication control and power chip technology, applied in the field of power electronics, can solve the problems of high cost, large chip area, long chip production cycle, etc., and achieve the effect of reducing cost and process difficulty

Pending Publication Date: 2021-03-26
SILERGY SEMICON TECH (HANGZHOU) CO LTD
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  • Abstract
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Problems solved by technology

At the same time, if the voltage difference between the two control circuits is very high, a high-voltage isolation ring is needed to isolate the high-voltage device from the low-voltage device, which consumes a relatively large wafer area, and requires the manufacturing process of the epitaxial layer. The wafer production cycle is long and the cost is high. high

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  • Communication control circuit applied to power supply chip
  • Communication control circuit applied to power supply chip
  • Communication control circuit applied to power supply chip

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Embodiment Construction

[0027] The present invention is described below based on examples, but the present invention is not limited to these examples. In the following detailed description of the invention, some specific details are set forth in detail. The present invention can be fully understood by those skilled in the art without the description of these detailed parts. In order not to obscure the essence of the present invention, well-known methods, procedures, procedures, components and circuits have not been described in detail.

[0028] Additionally, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.

[0029] Meanwhile, it should be understood that in the following description, "circuit" refers to a conductive loop formed by at least one element or sub-circuit through electrical connection or electromagnetic connection. When an element or circuit is said to be "connected to" another eleme...

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Abstract

The invention discloses a communication control circuit applied to a power supply circuit. Control circuits with different reference grounds are respectively formed on a plurality of wafers, and the two wafers needing to be communicated are respectively connected through a level conversion circuit, so that the level conversion circuit bears the corresponding voltage difference, electrical isolation can be realized without a high-voltage isolation ring, and the process difficulty of wafer manufacturing is reduced. The cost is lowered.

Description

technical field [0001] The present invention relates to the technical field of power electronics, in particular to a communication control circuit applied in a power supply chip. Background technique [0002] In the application of power chips, the most common way is to achieve electrical isolation on the same chip, and a circle of isolation circuits is required between two control circuits with different reference grounds to achieve isolation. At the same time, if the voltage difference between the two control circuits is very high, a high-voltage isolation ring is needed to isolate the high-voltage device from the low-voltage device, which consumes a relatively large wafer area, and requires the manufacturing process of the epitaxial layer. The wafer production cycle is long and the cost is high. high. Contents of the invention [0003] In view of this, the object of the present invention is to provide a communication control circuit applied in a power supply chip. By f...

Claims

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Application Information

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IPC IPC(8): H02M1/088H02M7/219
CPCH02M1/088H02M7/219H02M1/084H02M1/4233Y02B70/10H02M1/0012H02M7/003
Inventor 邓建金津黄秋凯
Owner SILERGY SEMICON TECH (HANGZHOU) CO LTD
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