Glass passivation method for silicon mesa diodes
A mesa diode, glass passivation technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of increasing production costs and high equipment requirements, achieving low dependence, good graphics quality, and reduced process difficulty. Effect
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[0040] Example 1
[0041] In this embodiment, the glass passivation of the silicon mesa diode is performed with reference to the above method. Among them, the glass slurry is prepared as follows: ethyl cellulose is added to the butyl carbitol solution at a ratio of 1g:25ml, and after it is fully dissolved, it becomes the solvent for preparing the glass slurry, and the slurry solvent is mixed with the glass The powder is placed in an agate ball milling tank at a ratio of 1ml:2g for ball milling, the ball milling speed is 220 rpm, and the ball milling time is 8 hours to prepare glass slurry, and then the glass slurry is evenly coated on with a stainless steel scraper with a flat blade. On the silicon wafer with PN junction and chip mesa grooves, fill the mesa grooves with glass paste, use an infrared lamp to dry the above-mentioned glass paste coated wafers, and place the wafers on a flat quartz plate , Use a silica gel sticky roller to roll over the wafer evenly. The glass powder...
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