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Method for cleaning substrate

A substrate and photomask technology, applied in the field of substrate cleaning, can solve problems such as difficulties

Active Publication Date: 2021-03-30
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As feature sizes have decreased, the wavelengths of light used in lithography to pattern layers have also decreased, creating additional difficulties and enabling technological advances such as the use of extreme ultraviolet (EUV) as a light source, and phase-shift masks. become necessary

Method used

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  • Method for cleaning substrate
  • Method for cleaning substrate
  • Method for cleaning substrate

Examples

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Embodiment Construction

[0012] The following embodiments of the invention provide many different embodiments or examples of different means for implementing the provided objects. Specific examples of components and arrangements are described below to simplify embodiments of the invention. Of course, these are examples only and are not intended to be limiting. For example, in the following description, forming a first member over or on a second member may include an embodiment in which the first member and the second member are formed in direct contact, and may also include an embodiment in which the first member and the second member may be formed in direct contact. An embodiment in which an additional component is formed between the two components so that the first component and the second component are not in direct contact. In addition, the embodiments of the present invention may repeat element symbols and / or letters in various examples. This repetition is for simplicity and clarity and does no...

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Abstract

The embodiment of the invention relates to a method for cleaning a substrate. A method for cleaning a substrate includes receiving a photomask substrate comprising a multilayered reflective structuredisposed over a surface of the photomask substrate, a capping layer disposed on the multilayered reflective structure and an absorber, wherein the photomask substrate has a plurality of conductive nanoparticles disposed over the surface; applying a first mixture comprising a SC1 solution, a DI water and O3 to the photomask substrate to remove the conductive nanoparticles; and applying a DI water to rinse the photomask substrate. A removal rate of the conductive nanoparticles is greater than approximately 90%.

Description

technical field [0001] Embodiments of the invention relate to methods of cleaning a substrate. Background technique [0002] The semiconductor integrated circuit industry has experienced rapid development over the past few decades. Technological advances in semiconductor materials and design have produced ever smaller and more complex circuits. Such material and design advances have been achieved as technologies related to processing and fabrication have also undergone technological advances. In the course of semiconductor evolution, as the size of the smallest component that can be reliably produced has decreased, the number of interconnect devices per unit area has increased. [0003] Semiconductor manufacturing relies primarily on the process of photolithography, in which light of a given frequency is used to transfer a desired pattern onto a wafer undergoing semiconductor processing. To transfer the pattern onto the wafer, a reticle (also known as a mask or a reticle)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/08B08B3/02B08B3/12B82Y40/00
CPCB08B3/08B08B3/02B08B3/12B82Y40/00G03F1/82H01L21/0206G03F1/24G03F1/22G03F1/26G03F7/70925B08B2203/005H01L21/02068
Inventor 张浩铭林佳仕
Owner TAIWAN SEMICON MFG CO LTD