PCB through hole tin layer thickness device and electrochemical timing coulometry testing method thereof

Abstract

The invention discloses a PCB through hole tin layer thickness device. The device comprises a solution, a solution tank, a to-be-measured PCB, an auxiliary electrode, an electrochemical workstation, areference electrode and a pressure-sensitive adhesive tape; the solution tank is arranged below the to-be-measured PCB; a hose is fixed to one side of a top cover of the solution tank; one end of thehose is located in the solution; the other end of the hose is connected with an inlet of a booster pump; a through hole is formed in the to-be-measured PCB; the pressure-sensitive adhesive tape is symmetrically arranged at the two ends of the through hole in the to-be-measured PCB; O-shaped rings are fixed to the sides, away from the to-be-measured PCB, of the pressure-sensitive adhesive tape; and the O-shaped rings at the upper end of the to-be-measured PCB are connected with the hose. The average tin thickness in the through hole with any hole diameter is measured by adopting a pressure-sensitive adhesive tape mask method and an electrochemical timing coulometry method; the method is suitable for quickly and accurately measuring the average tin thickness in through holes with all hole diameters of PCBs, is simple in operation, and small in measurement data error.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a PCB through-hole tin layer thickness device and an electrochemical chronoelectric method for testing the same. Background technique [0002] PCB is a printed circuit board, referred to as a printed board, and is one of the important components of the electronics industry. Almost every kind of electronic equipment, ranging from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as there are electronic components such as integrated circuits, in order to make the electrical interconnection between various components, printed circuit boards must be used. plate. The printed circuit board is composed of an insulating base plate, connecting wires and pads for assembling and welding electronic components, and has the dual functions of a conductive line and an insulating base plate. It can replace complex...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of PCB through-hole tin layer thickness equipment and its electrochemical chronoelectric method test method, have the advantages of fast and accurate measurement of the average tin thickness in all through holes of PCB board and simple operation and small error, and solve the problem Traditional measurement errors are large, the test time is long and the operation is cumbersome.

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