Support and power module
A technology of power modules and power devices, which is applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of complex terminal installation, heavy weight, and large volume, so as to increase heat dissipation performance, speed up assembly efficiency, Improve the effect of fitting range
Active Publication Date: 2021-03-30
FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
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Problems solved by technology
[0002]
In recent years, with the development of power electronic systems towards high frequency and high power density, the application of double-sided packaged power devices has become more and more frequent. Insufficient, and the common clip-type heat sink is not suitable for double-sided packaging power devices with different thicknesses because the heat sink is fixed by welding, and the distance between the heat sinks cannot be changed. It is inconvenient in practical applications, so it needs Redesign the heat dissipation structure of double-sided packaging power devices
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[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0037] figure 1 A schematic three-dimensional structure diagram showing a power module according to an embodiment of the present invention;
[0038] figure 2 It shows a schematic top view of the power module according to the embodiment of the present invention;
[0039] image 3 It shows a schematic cross-sectional structure diagram of the A-A cross-section of the power module of the embodiment of the present invention. Since this view is a symmetrical structur...
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The invention discloses a support and a power module. The support comprises more than two runner pipes and more than two runner plates, each runner pipe is provided with a main runner arranged along the axial direction in a penetrating manner and a branch runner penetrating through the side wall of the runner pipe; and each runner plate comprises a body and two or more sliding sleeves. Heat dissipation runners are formed in the bodies, the sliding sleeves are arranged on the corresponding bodies, the sliding sleeves are provided with connecting runners which penetrate through the side walls ofthe sliding sleeves and are communicated with the heat dissipation runners of the corresponding bodies, and the axes of the more than two runner pipes are parallel to each other. Any sliding sleeve on the runner plate is matched with one corresponding runner pipe, and the connecting runner on the sliding sleeve is communicated with the corresponding sub-runner on the corresponding runner pipe. The support flexibly adjusts the distance between the adjacent runner plates according to requirements, and can adapt to power devices with different thicknesses. By adjusting the number of the runner plates, the support can be suitable for the power modules with different numbers of power devices, and has good assembly convenience.
Description
technical field [0001] The invention relates to the field of electronic components, in particular to a bracket and a power module. Background technique [0002] In recent years, with the development of power electronic systems towards high frequency and high power density, the application of double-sided packaged power devices has become more and more frequent. Insufficient, and the common clip-type heat sink is not suitable for double-sided packaging power devices with different thicknesses because the heat sink is fixed by welding, and the distance between the heat sinks cannot be changed. It is inconvenient in practical applications, so it needs Redesign the heat dissipation structure of double-sided packaging power devices. Contents of the invention [0003] Aiming at the shortcomings of the existing heat dissipation structure, the present invention provides a bracket and a power module. The bracket can flexibly adjust the distance between adjacent flow channel plates...
Claims
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IPC IPC(8): H01L23/32H01L23/40H01L23/473H01L25/07
CPCH01L23/32H01L23/473H01L23/4012H01L25/074
Inventor 谢健兴杨宁詹洪桂陈晓仪林宇珊袁毅凯
Owner FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD