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Semiconductor device

A semiconductor and conductor technology, applied in the field of semiconductor devices, can solve the problems of increasing transmission distance and hindering high-speed operation.

Pending Publication Date: 2021-03-30
SONY SEMICON SOLUTIONS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to SiP, there is a possibility that the transmission distance will increase due to wiring interconnecting semiconductor substrates, which hinders high-speed operation

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
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Embodiment Construction

[0073] Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as examples) will be described. Description will be given in the following order.

[0074] 1. Semiconductor device

[0075] 2. Use conductors for wiring

[0076] 3. Joint surface

[0077] 4. Manufacturing steps

[0078] 5. Example of application to power wiring

[0079] 6. Application example to endoscopic surgery system

[0080] 7. Example of application to moving objects

[0081]

[0082] [Structure of solid-state imaging device]

[0083] figure 1 is a diagram showing a configuration example of a solid-state imaging device as an example of a semiconductor device according to an embodiment of the present invention. This solid-state imaging device has a complementary metal oxide semiconductor (CMOS: Complementary Metal Oxide Semiconductor) image sensor. This solid-state imaging device includes an imaging element 10 and a peripheral circuit section on a semiconductor subst...

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PUM

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Abstract

In this semiconductor device comprising a laminate semiconductor substrate in which multilayer wiring layers of a plurality of semiconductor substrates are electrically connected, regions near joinedsurfaces between the semiconductor substrates are used effectively. The laminate semiconductor substrate comprises a plurality of semiconductor substrates in which respective multilayer wiring layersare formed. In the laminate semiconductor substrate, the multilayer wiring layers are electrically connected and joined together. Conductors are formed near the joined surfaces between the semiconductor substrates. The conductors are formed so as to supply electricity in the direction of the joined surfaces.

Description

technical field [0001] The present invention relates to semiconductor devices. Specifically, the present invention relates to a semiconductor device including a stacked semiconductor substrate that electrically connects multilayer wiring layers of a plurality of semiconductor substrates to each other. Background technique [0002] In recent years, digital cameras have become increasingly popular. Along with this, the demand for a solid-state imaging device (image sensor), which is a core component of a digital camera, is also increasing. With regard to the performance of solid-state imaging devices, technological development for realizing higher image quality and higher functions is progressing. On the other hand, the spread of portable terminals (mobile phones, personal digital assistants (PDA: Personal Digital Assistant), notebook PCs (Personal Computer: personal computers), tablet computers, etc.) having an imaging function is progressing. Along with this, in order to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/065H01L21/02H01L21/3205H01L21/768H01L21/8234H01L23/522H01L25/07H01L25/18H01L27/088H01L27/146
CPCH01L25/18H01L2224/08058H01L2224/08121H01L2224/05556H01L2224/05096H01L2224/80895H01L2224/80896H01L2224/8083H01L2224/80013H01L2224/0346H01L2224/80986H01L24/80H01L24/08H01L24/05H01L24/09H01L2224/091H01L27/14636H01L27/1464H01L27/14621H01L27/14605H01L27/14634H01L27/1469H01L27/14623H01L2224/80357H01L25/50H01L2224/08145H01L2224/09517H01L2924/00014H01L2224/05553H01L2224/08146
Inventor 山岸肇佐藤英史山崎彰关原孝幸早渊诚石崎俊介
Owner SONY SEMICON SOLUTIONS CORP
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