Supercharge Your Innovation With Domain-Expert AI Agents!

High frequency adhesive bonding

An adhesive, high-frequency technology, applied in the direction of adhesive heating, bonding method, adhesive, bonding shoe parts, etc.

Pending Publication Date: 2021-04-02
ESSENTIUM INC
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The second conductive plate is electrically grounded

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High frequency adhesive bonding
  • High frequency adhesive bonding
  • High frequency adhesive bonding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The following description is merely exemplary in nature and is not intended to limit the disclosure, application or uses.

[0032] The present invention provides a system for bonding a first layer of material to a second layer of material. The material layer may be selected from various material compositions. For example, the layer of material may be used to form or make a variety of different products, such as shoes or athletic shoes.

[0033] refer to figure 1 and figure 1 a, Top and side views, respectively, showing a shoe or athletic shoe 10 according to an aspect of the invention and a system 12 for bonding a first material layer to a second material layer. For example, athletic shoe 10 is a product that may be manufactured using system 12 for bonding a first layer of material to a second layer of material.

[0034] Athletic shoe 10 has an outsole 14 , a midsole 16 and an upper 18 . The outsole 14 can also be called a sole, and is the bottom part of the sports...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A system and method for bonding a first layer of material to a second layer of material includes a first electrically conductive plate, a second electrically conductive plate spaced apart from the first electrically conductive plate. The second electrically conductive plate is electrically grounded. A high frequency generator in electrical communication with the first electrically conductive platesupplies high frequency electrical signals to the first electrically conductive plate. An adhesive applied to one of the first and second layers of material has an electromagnetic susceptor materialthat, when subjected to the electric field, heats the adhesive to an adhesive curing temperature to bond the first layer of material to the second layer of material. A clamping mechanism applies pressure to one of the first and second layers of material to maintain contact between the first and second layers until an adhesive cure time has lapsed.

Description

technical field [0001] The present disclosure generally relates to bonding layers of material with an adhesive system using electromagnetic fields. Background technique [0002] The statements in this section merely provide background information related to the present disclosure and may or may not constitute prior art. [0003] Typical adhesive systems are pressure cured and / or heat cured by oven, infrared heating or steam. For example, during shoemaking, the entire shoe is heated to transfer heat to the adhesive, which cures and bonds the layers of the shoe. Usually the material used in footwear has a moderate thermal conductivity, so it takes a long time to heat up to the core with adhesive. In addition, the excessive heat required to cure the adhesive can damage the materials used in footwear. [0004] Accordingly, while current adhesive systems achieve their intended purpose, there remains a need for a new and improved system and method for bonding materials, for exa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/52H01L21/56H01L23/00
CPCA43D25/20A43B1/0009C09J2301/416C09J5/06B29C65/4815B29C65/4835B29C65/4885B29C65/489B29C66/1122B29C66/5326B29C65/04B29C65/3676B29C65/3684B29C65/3612B29C65/3616B29L2031/504B29C66/712B29C66/71B29C66/7392B29C66/7484B29C66/234B29C66/232B29C66/242B29C66/8322B29C66/8242B29C65/525B29C65/4855B29K2023/083B29K2021/00
Inventor C·B·斯威尼
Owner ESSENTIUM INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com