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Moisture-curable hot melt adhesive capable of being quickly cured at low temperature

A fast-curing, moisture-curing technology, applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc. The effect of the bonding effect

Inactive Publication Date: 2021-04-13
黄世斌
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Existing hot melt adhesives are difficult to quickly solidify under low temperature conditions, including moisture curing, especially when the effect is relatively general in edge sealing and bonding, especially the recycled products of the leftovers in the wood processing process— When bonding laminate, HDF, LDF and particle boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The invention provides a moisture-curing hot-melt adhesive rapidly solidified at low temperature, comprising the following quality components:

[0025] 10 parts of crystalline polyester polyols;

[0026] 20 parts of polyether polyol;

[0027] 10 parts of acrylic resin;

[0028] 10 parts of isocyanate;

[0029] 20 parts of liquid polyester polyol;

[0030] 10 parts of modified epoxy resin;

[0031] 5 parts of tackifying resin.

[0032] Further, the composition of crystalline polyester polyol is CMA-66, CMA-44, CMA-2066, POL-S3500, POL-328, DYNACOll-7360, DYNACOll-7361, XCP-3000B, XCP-44, XCP- The mixture of one or more of 2000H and XCP-3000H, the number average molecular weight of crystalline polyester polyol is 1000-8000.

[0033] Further, the composition of polyether polyol is a mixture of one or more of DL-400, DL-1000D, DL-2000D, DL-4000D, EP-330N, MN-3050D, VOANOL2110TB, VOANOL2120 and VOANOL4240, The number average molecular weight of the polyether polyol is...

Embodiment 2

[0040] The invention provides a moisture-curing hot-melt adhesive rapidly solidified at low temperature, comprising the following quality components:

[0041] 30 parts of crystalline polyester polyols;

[0042] 50 parts of polyether polyols;

[0043] 30 parts of acrylic resin;

[0044] 20 parts of isocyanate;

[0045] 30 parts of liquid polyester polyol;

[0046] 30 parts of modified epoxy resins;

[0047] 10 parts of tackifying resin.

[0048] Further, the composition of crystalline polyester polyol is CMA-66, CMA-44, CMA-2066, POL-S3500, POL-328, DYNACOll-7360, DYNACOll-7361, XCP-3000B, XCP-44, XCP- The mixture of one or more of 2000H and XCP-3000H, the number average molecular weight of crystalline polyester polyol is 1000-8000.

[0049] Further, the composition of polyether polyol is a mixture of one or more of DL-400, DL-1000D, DL-2000D, DL-4000D, EP-330N, MN-3050D, VOANOL2110TB, VOANOL2120 and VOANOL4240, The number average molecular weight of the polyether polyol i...

Embodiment 3

[0056] The invention provides a moisture-curing hot-melt adhesive rapidly solidified at low temperature, comprising the following quality components:

[0057] 50 parts of crystalline polyester polyols;

[0058] 70 parts of polyether polyols;

[0059] 50 parts of acrylic resin;

[0060] 30 parts of isocyanate;

[0061] 40 parts of liquid polyester polyol;

[0062] 40 parts of modified epoxy resins;

[0063] 20 parts of tackifying resin.

[0064] Further, the composition of crystalline polyester polyol is CMA-66, CMA-44, CMA-2066, POL-S3500, POL-328, DYNACOll-7360, DYNACOll-7361, XCP-3000B, XCP-44, XCP- The mixture of one or more of 2000H and XCP-3000H, the number average molecular weight of crystalline polyester polyol is 1000-8000.

[0065] Further, the composition of polyether polyol is a mixture of one or more of DL-400, DL-1000D, DL-2000D, DL-4000D, EP-330N, MN-3050D, VOANOL2110TB, VOANOL2120 and VOANOL4240, The number average molecular weight of the polyether polyol...

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Abstract

The invention discloses a moisture-curable hot melt adhesive capable of being quickly cured at low temperature. The moisture-curable hot melt adhesive capable of being quickly cured at low temperatureis prepared from the following raw materials in parts by mass: crystalline polyester polyol, polyether polyol, acrylic resin, isocyanate, liquid polyester polyol, modified epoxy resin and tackifying resin. The component of the crystalline polyester polyol is one or a mixture of more of CMA-66, CMA-44, CMA-2066, POL-S3500, POL-328, DYNACOll-7360, DYNACOll-7361, XCP-3000B, XCP-44, XCP-2000H and XCP-3000H, and the component of the polyether polyol is one or a mixture of more of DL-400, DL-1000D, DL-2000D, DL-4000D, EP-330N, MN-3050D, VOANOL2110TB, VOANOL2120 and VOANOL4240. The moisture-curable hot melt adhesive capable of being quickly cured at low temperature can be quickly cured at low temperature, and is suitable for general popularization and application.

Description

technical field [0001] The invention belongs to the technical field of hot-melt adhesives, in particular to a moisture-curing hot-melt adhesive that solidifies rapidly at low temperature. Background technique [0002] Hot melt adhesive is a kind of plastic adhesive. Its physical state changes with temperature within a certain temperature range, but its chemical properties remain unchanged. It is non-toxic and tasteless, and is an environmentally friendly chemical product. Because the product itself is solid, easy to pack, transport, store, solvent-free, non-polluting, and non-toxic; and it has the advantages of simple production process, high added value, strong bonding strength, and fast speed. The basic resin of hot melt adhesive is the copolymerization of ethylene and vinyl acetate under high temperature and pressure, that is, EVA resin. This resin is the main ingredient in making hot melt adhesives. [0003] Existing hot melt adhesives are difficult to quickly solidify...

Claims

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Application Information

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IPC IPC(8): C09J175/06C09J175/08C09J11/08C08G18/42C08G18/48C08G18/62C08G18/58
CPCC09J175/06C09J175/08C09J11/08C08G18/42C08G18/48C08G18/6216C08G18/58C08G18/4063C08G18/6204C08L101/00
Inventor 黄世斌
Owner 黄世斌
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