Probe card maintenance and correction method

Abstract

The invention discloses a probe card maintenance and correction method. The maintenance and correction method comprises the following steps: step 1, correcting a reference point by adopting a standard probe card and a standard calibration sheet; step 2, placing the standard calibration sheet at a first reference point position, performing magnification projection with a first magnification factor on each needle position of the standard calibration sheet to form magnified needle positions on a projection surface, and marking each magnified needle position; step 3, placing a to-be-corrected probe card at a second reference point position, and projecting the tip of the probe of the to-be-corrected probe card by adopting a second magnification factor to form a magnified tip; and step 4, correcting the probe of the to-be-corrected probe card according to the deviation value of each amplified tip and the corresponding amplified probe position so that the corrected amplified tip is matched with the position of the corresponding amplified probe position. According to the invention, the probe correction difficulty of the probe card can be reduced, the operation window is improved, and the training requirement and the operation difficulty of maintenance personnel are reduced.

Description

technical field [0001] The invention relates to a method for manufacturing a semiconductor integrated circuit, in particular to a method for maintaining and correcting a probe card. Background technique [0002] The probe card is an extremely important test consumable in the wafer test (Chip Probing, CP) process, and the condition of the probe card during the test directly affects the accuracy and repeatability of the test wafer test. Therefore, the maintenance of the status of the probe card is particularly important, which is directly related to the quality and reliability of the wafer shipment. [0003] However, due to the loss during wafer testing and other reasons, there are many abnormal conditions in the probe card. Abnormal conditions mainly include needle position offset, needle tip contamination, needle melting and burning, etc. The above conditions seriously affect the accuracy of wafer testing. Among them, the needle position deviation is the most common and fr...

AI Technical Summary

Problems solved by technology

But in fact, the size of the probe is very small, and the adjustment of the position of the probe card is mainly operated under a microscope, which requires extremely high fine operation ability, and the operation window is small

For needle card maintenance personnel, it requires high time cost training and proficiency, and the requirements for needle card maintenance work are extremely high

Images