Gasket and its manufacturing method, package structure and its manufacturing method
A packaging structure and gasket technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as difficulty, occupy a large space, limit the space of passive components, etc., achieve good electrical performance, save space, The effect of reducing the device
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[0071] For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of exemplary embodiments of the present application and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.
[0072] It should be noted that in this specification, the expressions first, second, third etc. are only used to distinguish one feature from another feature and do not imply any limitation on the feature. Accordingly, the first electrode discussed below may also be referred to as a second electrode without departing from the teachings of the present application. vice versa.
[0073] In the drawin...
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