Automatic centering mechanism for directional table wafer

Abstract

The invention discloses an automatic centering mechanism for a wafer of an orientation table. The automatic centering mechanism comprises a centering drag hook (1), a fixing bracket (2), a camera (3), a wafer (4), an orientation shaft (5), a cam (6), a tray (7), a cam shaft (8) and magnetic fluid (9). According to the automatic centering mechanism, the cam shaft (8) is driven by the rotation of the cam (6) to slide linearly in the fixing bracket (2) so as to contract the centering drag hook (1) inwards, and the wafer (4) is pushed to move towards the center of a circle, so that the automatic centering function is realized, the complex process of calculation and compensation is omitted, the position precision and calibration efficiency of the wafer can be improved, and the wafer transmission efficiency is improved.

Description

technical field [0001] The invention relates to a semiconductor wafer transmission system, in particular to an automatic centering mechanism for an orientation table wafer of an ion implanter. Background technique [0002] In the field of semiconductor ion implantation, with the continuous improvement of technical requirements such as process integration and low-energy shallow junction doping, there are also higher requirements for the implantation angle and transmission accuracy of the wafer during the implantation process. The accuracy and stability of wafer transfer affect the productivity of equipment, so an efficient and stable wafer transfer system is very important. In the wafer transfer system, the accuracy and stability of the manipulator and the orientation table directly determine the efficiency of the entire transfer system. To improve the transfer efficiency, it is very important to accurately calibrate the position of the wafer on the orientation stage, so tha...

AI Technical Summary

Problems solved by technology

If the wafer is in the wrong position on the orientation table, it may cause the wafer orientation to fail, or even cause the wafer to slip and cause debris

The calibration of the wafer position on the traditional orientation table is generally performed manually, which has low efficiency and poor accuracy, and needs to break the vacuum, or perform position compensation through the manipulator, which requires position detection. The manipulator picks and places the wafer, and the transfer efficiency is low. New errors may be introduced during calibration

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