Annealing sheet machining die capable of conducting buffering

Abstract

The invention discloses an annealing sheet machining die capable of conducting buffering. The annealing sheet machining die capable of conducting buffering comprises a fixed base, first mounting air cylinders, a damping rotating rod and a second mounting air cylinder, wherein a connecting and limiting block is connected to the upper surface of the middle of the fixed base in an attached mode; a lower die body is connected to the inner side of the connecting and limiting block; the first mounting air cylinders are connected to the inner sides of the left end and right end of the fixed base in an embedded mode; an upper die body is arranged on the lower surface of the middle of a movable top plate; limiting round rods are connected to the inner sides of the lower ends of fixed sleeve rods in a clamped mode; and the damping rotating rod is located on the inner side of the right rear end of the movable top plate. According to the annealing sheet machining die capable of conducting buffering, the resistance of the stamping machining on an annealing sheet can be conveniently reduced, and the stamping machining efficiency is improved; the annealing sheet can be buffered, and the quality of the annealing sheet obtained after the stamping machining is improved; the annealing sheet obtained after the stamping machining and waste can be conveniently collected; and meanwhile, parts can be conveniently replaced, so that the service life is long.

Description

technical field [0001] The invention relates to the technical field of annealing sheet processing, in particular to a buffering mold for annealing sheet processing. Background technique [0002] Since the integrated circuit industry is the core of the information technology industry, it is an important basic, leading and strategic industry of the country, and it is also a major high-tech that promotes the development of the national economy and information technology, and the finished product of integrated circuits can be improved through good annealing films. Therefore, with the rise of the high-end integrated circuit market in China, the demand and requirements for silicon annealed sheets are getting higher and higher. For this reason, annealed sheets are often stamped through molds in order to use annealed sheets and improve the yield of integrated circuits. ; [0003] The existing molds for processing annealed sheets are generally inconvenient to reduce the resistance t...

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Problems solved by technology

[0004] The object of the present invention is to provide a kind of mold that can carry out cushioning annealing sheet processing, to solve the existing annealing sheet processing mold that proposes in the above-mentioned background technology, it is generally inconvenient to reduce the resistance to annealing sheet punching process, to the annealing sheet The efficiency of stamping processing is low, and it is generally not possible to buffer the annealed sheet, which easily affects the quality of the annealed sheet, and it is not convenient to collect the annealed sheet and waste after stamping processing, and the service life is short

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