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Through hole electroplating method for printed circuit board

A printed circuit board and through-hole electroplating technology, which is applied in the direction of printed circuit, printed circuit manufacturing, and electrical connection formation of printed components, can solve the problems of small difference in flow rate of electroplating solution, uneven thickness of plating layer, etc., and achieve improvement Deep plating ability value, good dispersibility, effect of promoting flow

Inactive Publication Date: 2021-04-23
上海天承化学有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the nozzle is located at the lower end of one side or both sides of the PCB, the difference in the flow rate of the plating solution on both sides of the same hole of the PCB is small and uneven, and uneven thickness of the coating in the hole or hole plugging are prone to occur.

Method used

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  • Through hole electroplating method for printed circuit board
  • Through hole electroplating method for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] This embodiment provides a method for through-hole plating of a printed circuit board, such as figure 1 As shown, the through-hole electroplating method includes the steps of:

[0050] (1) The printed circuit board 2 to be electroplated and the first anode plate 3 and the second anode plate 4 are vertically immersed in the electroplating solution, and the first anode plate 3 and the second anode plate 4 are respectively located in the On both sides of the electroplated printed circuit board 2, the printed circuit board 2 to be electroplated is connected to the first anode plate 3 and the second anode plate 4 through a power supply 1;

[0051] (2) The first nozzle frame 5 and the first suction pipe frame 6 are respectively arranged on both sides of the printed circuit board 2 to be electroplated, and the first nozzle frame 5 sprays the plating solution vertically on the surface to be electroplated. On the board surface of the printed circuit board 2, the first suction p...

Embodiment 2

[0056] This embodiment provides a method for through-hole plating of a printed circuit board, the schematic diagram of this embodiment and figure 1 Same, described through-hole electroplating method comprises the steps:

[0057] (1) The printed circuit board 2 to be electroplated and the first anode plate 3 and the second anode plate 4 are vertically immersed in the electroplating solution, and the first anode plate 3 and the second anode plate 4 are respectively located in the On both sides of the electroplated printed circuit board 2, the printed circuit board 2 to be electroplated is connected to the first anode plate 3 and the second anode plate 4 through a power supply 1;

[0058] (2) The first nozzle frame 5 and the first suction pipe frame 6 are respectively arranged on both sides of the printed circuit board 2 to be electroplated, and the first nozzle frame 5 sprays the plating solution vertically on the surface to be electroplated. On the board surface of the printed...

Embodiment 3

[0063] This embodiment provides a method for through-hole plating of a printed circuit board, the schematic diagram of this embodiment and figure 1 Identical, described through-hole electroplating method comprises the steps:

[0064](1) The printed circuit board 2 to be electroplated and the first anode plate 3 and the second anode plate 4 are vertically immersed in the electroplating solution, and the first anode plate 3 and the second anode plate 4 are respectively located in the On both sides of the electroplated printed circuit board 2, the printed circuit board 2 to be electroplated is connected to the first anode plate 3 and the second anode plate 4 through a power supply 1;

[0065] (2) The first nozzle frame 5 and the first suction pipe frame 6 are respectively arranged on both sides of the printed circuit board 2 to be electroplated, and the first nozzle frame 5 sprays the plating solution vertically on the surface to be electroplated. On the board surface of the pri...

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Abstract

The invention relates to a through hole electroplating method for a printed circuit board. The through hole electroplating method specifically comprises the steps of arranging a first spray pipe frame and a first suction pipe frame on the two sides of the printed circuit board to be electroplated correspondingly; vertically spraying electroplating liquid to the board surface of the printed circuit board to be electroplated by the first spray pipe frame; vertically sucking the electroplating liquid between the first suction pipe frame and the printed circuit board to be electroplated by the first suction pipe frame; connecting the first spray pipe frame with the first suction pipe frame through a first pump; and arranging a first magnetic field between the first suction pipe frame and the printed circuit board to be electroplated. According to the through hole electroplating method, the electroplating liquid is vertically sprayed from one side of the printed circuit board to be electroplated and vertically sucked from the other side of the printed circuit board to be electroplated, meanwhile, the magnetic field is arranged on the sucked side, the pressure difference of the two sides of a through hole is effectively increased, flowing of the electroplating liquid in the through hole is promoted, the dispersity of electroplated copper is better, and the deep plating capacity value is increased.

Description

technical field [0001] The invention relates to the technical field of electroplating of printed circuit boards, in particular to a through-hole electroplating method of printed circuit boards. Background technique [0002] With the continuous development of chip technology, modern electronic products are increasingly pursuing high-performance requirements for functional integration, leading the development of printed circuit boards for their component supports to be miniaturized, functionalized and highly integrated, especially in In the field of IC substrates and similar substrates, the requirements for printed circuit boards are extremely high. Due to the reduction in the volume of electronic products, the density of circuit layout and wiring of printed circuit boards has increased, and through-hole copper plating is one of the methods for IC substrates and similar substrates to achieve interlayer interconnection. Therefore, the through-hole copper plating The quality wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/08H05K3/42
CPCC25D5/08H05K3/424
Inventor 王科林章清黄叔房刘江波章晓冬王亚君童茂军
Owner 上海天承化学有限公司