Cleaning method of high-frequency flexible microwave printed circuit board

A technology for printed circuit boards and circuit boards, which is used in secondary processing of printed circuits, cleaning/polishing of conductive patterns, etc. The effect of improving the curing effect and reducing the production cost

Active Publication Date: 2021-04-23
四川省华盾防务科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems of unsatisfactory cleaning effect, easy to cause wire scratches and low efficiency in the existing circuit board cleaning method, the purpose of the present

Method used

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  • Cleaning method of high-frequency flexible microwave printed circuit board
  • Cleaning method of high-frequency flexible microwave printed circuit board
  • Cleaning method of high-frequency flexible microwave printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0061] Such as Figure 1~3 As shown, the high-frequency flexible microwave printed circuit board cleaning method provided in the first aspect of this embodiment can isolate the precipitated epoxy resin from the wires on the surface of the circuit board 13 by using a high-temperature resistant protective film 14, so as to achieve circuit The board 13 is clean and tidy after bonding, not only to ensure that the wires are not damaged, but also to improve the cleaning quality and efficiency, which is conducive to the mass production of the circuit board 13 .

[0062] The method for cleaning a high-frequency flexible microwave printed circuit board provided in this embodiment may, but is not limited to, include the following steps S101-S103.

[0063] S101. Paste a high temperature resistant protective film on the wiring surface of the circuit board, and use the high temperature resistant protective film to completely cover the wiring surface of the circuit board.

[0064] Step S10...

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PUM

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Abstract

The invention discloses a cleaning method of a high-frequency flexible microwave printed circuit board, and the method comprises the steps: attaching a high-temperature-resistant protection film to a wiring surface of a circuit board, and enabling the wiring surface of the circuit board to be completely covered by the high-temperature-resistant protection film; performing high-temperature curing treatment on the circuit board attached with the high-temperature-resistant protective film to obtain a finished circuit board; carrying out film removing treatment on the finished circuit board so as to remove the high-temperature-resistant protective film on the finished circuit board and obtain a cleaned finished circuit board; according to the invention, the precipitated epoxy resin is isolated from the wire on the surface of the circuit board by using the high-temperature-resistant protective film, so that the purpose that the circuit board is clean and tidy after being bonded is achieved, the wire is not damaged, the cleaning quality and efficiency can be improved, and the large-batch production of the circuit board is facilitated.

Description

technical field [0001] The invention relates to the technical field of production and assembly of high-frequency flexible circuit boards, in particular to a cleaning method for high-frequency flexible microwave printed circuit boards. Background technique [0002] The high-frequency flexible microwave circuit board is the carrier of high-frequency electrical signals and microwave signals in the microwave radio frequency module assembly, and is an indispensable and important part of the microwave radio frequency module assembly. [0003] At present, the high-frequency flexible microwave circuit board in the microwave radio frequency module assembly mainly adopts the conductive adhesive bonding process (that is, the conductive adhesive is applied on the back of the circuit board to realize the electrical conduction of each connecting material in the circuit board), and the conductive adhesive belongs to the ring Oxygen resin adhesives, during the high-temperature curing proces...

Claims

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Application Information

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IPC IPC(8): H05K3/26
CPCH05K3/26
Inventor 高金鑫
Owner 四川省华盾防务科技股份有限公司
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