Dual scanner three-dimensional printer using selective laser sintering

Abstract

The invention discloses a dual scanner three-dimensional printer using selective laser sintering. More specifically, the double-scanner three-dimensional printer using selective laser sintering is applicable to double scanners and can greatly shorten the tact time of a three-dimensional structure. When the double-scanner three-dimensional printer using selective laser sintering is applicable to double scanners, the irradiation range of each scanner can cover the whole forming bed under the condition that the scanners do not interfere with each other, the production cost is reduced by using one flat-field focus lens together, and the double-scanner three-dimensional printer using selective laser sintering has many advantages such as efficient configuration of the scanners.

Description

technical field [0001] The invention relates to a three-dimensional structure stacking device which uses laser to stack three-dimensional structures through sintering. More specifically, in order to irradiate laser light and perform selective sintering, it is necessary to change the laser path, and a three-dimensional structure stacking device using a scanner is used in the process of changing the laser path. Background technique [0002] Existing technologies utilize processes such as machining or injection molding to manufacture three-dimensional structures such as mechanical parts or plastic products. Recently, three-dimensional printers that manufacture such three-dimensional structures by stacking cross-sectional layers have become popular. [0003] Three-dimensional printers are divided into several types according to the stacking method, for example, Selective Laser Sintering (SLS, Selective Laser Sintering), which uses lasers to selectively sinter powder materials, ...

AI Technical Summary

Problems solved by technology

The existing SLS 3D printer is equipped with a scanner on the forming bed to change the laser path and thereby form a 3D structure through selective sintering and stacking, because the use of a scanner makes the tact time (tact time) longer, and the tact time Large deviations occur with the shape and volume of three-dimensional structures

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