Hot film-type air flow meter and production method thereof

Abstract

The invention relates to an apparatus (110, 112) for determining at least one parameter of a fluid medium, in particular an intake-air mass of an internal combustion engine. The apparatus (110, 112) comprises a sensor chip (148) for measuring the parameter and a drive and evaluation electronic system (156) with a circuit carrier (160). The sensor chip (148) is arranged on a chip carrier (146) which can be placed into the fluid medium. The chip carrier (146) comprises a protrusion (166) of the circuit carrier (160), which protrusion is integral with the circuit carrier (160), wherein the sensorchip (148) is fixed to the protrusion (166).

Description

technical field [0001] The invention relates to a known device for measuring at least one parameter of a flowing fluid medium, in particular of a fluid medium flowing through a draft tube, as is known from various fields of the prior art. Therefore, in many processes, for example in the fields of method technology, chemistry or mechanical engineering, fluid media, especially gaseous masses, must be conveyed in a defined manner with specific characteristics (such as temperature, pressure, flow velocity, mass flow, etc.) (e.g. air quality). This is especially the case for combustion processes, which take place under defined conditions. Background technique [0002] An important application example is the combustion of fuels in internal combustion engines of vehicles, in particular with subsequent catalytic exhaust gas cleaning, in which processes a certain air mass (air mass flow) must be delivered per unit of time defined. To measure the air mass flow, various types of sens...

AI Technical Summary

Problems solved by technology

[0007] However, this known manufacturing method and the devices made therefrom still leave room for improvement

Especially for mounting the sensor chip in or onto a chip carrier, a large number of individual steps are required which make the manufacturing process more expensive, especially the end product, or reduce the profit margin

Another disadvantage is that the curing of the adhesive in the oven may in turn lead to damage to the electronic device already inserted, and since the sensor chip usually has a gap inside the chip carrier or the recess of the chip carrier before curing, it may be caused by the sensor chip. Component tolerances due to chip slippage on uncured adhesive

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