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Ceramic particle wet spraying equipment for surface treatment of electronic materials and spraying method thereof

A technology of ceramic particles and electronic materials, applied in the direction of spraying devices, liquid spraying devices, etc., can solve problems such as excessive spraying and uneven spraying on the surface of electronic materials

Active Publication Date: 2022-07-05
翰贝摩尔表面技术(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, due to the irregular spraying method of the existing ceramic spraying, the local spraying is too thick or the rest of the spraying is too thin, resulting in uneven spraying on the surface of electronic materials

Method used

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  • Ceramic particle wet spraying equipment for surface treatment of electronic materials and spraying method thereof
  • Ceramic particle wet spraying equipment for surface treatment of electronic materials and spraying method thereof
  • Ceramic particle wet spraying equipment for surface treatment of electronic materials and spraying method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] like Figure 1-2 As shown, the ceramic particle wet spraying equipment for surface treatment of electronic materials includes a material box, and the material box includes a particle cavity 1 and a water cavity 2. The particle cavity 1 and the water cavity 2 are respectively connected with the mixing pipe 6 through the connecting pipe 5, and the mixing A screw mixing shaft is rotatably connected in the material pipe 6, and the bottom end of the screw mixing shaft is fixedly connected with the spray pipe 8. The spray pipe 8 is connected with the mixing pipe 6 in a sealed rotation. The port 81 is communicated with the nozzle 10 which is axially slidably connected on the nozzle 8. The top of the nozzle 10 is connected with a limit rod 12, and the limit rod 12 is slidably connected with the limit plate 7 fixedly connected to the outside of the mixing pipe 6. The bottom of the limit plate 7 A spiral limiting groove 71 is provided on the side, and a stage 11 is provided below...

Embodiment 2

[0035] like Figure 1-4As shown, the ceramic particle wet spraying equipment for surface treatment of electronic materials includes a material box, and the material box includes a particle cavity 1 and a water cavity 2. The particle cavity 1 and the water cavity 2 are respectively connected with the mixing pipe 6 through the connecting pipe 5, and the mixing A screw mixing shaft is rotatably connected in the material pipe 6, and the bottom end of the screw mixing shaft is fixedly connected with the spray pipe 8. The spray pipe 8 is connected with the mixing pipe 6 in a sealed rotation. The port 81 is communicated with the nozzle 10 which is axially slidably connected on the nozzle 8. The top of the nozzle 10 is connected with a limit rod 12, and the limit rod 12 is slidably connected with the limit plate 7 fixedly connected to the outside of the mixing pipe 6. The bottom of the limit plate 7 A spiral limiting groove 71 is provided on the side, a stage 11 is provided below the ...

Embodiment 3

[0038] like Figure 1-6 As shown, the ceramic particle wet spraying equipment for surface treatment of electronic materials includes a material box, and the material box includes a particle cavity 1 and a water cavity 2. The particle cavity 1 and the water cavity 2 are respectively connected with the mixing pipe 6 through the connecting pipe 5, and the mixing A screw mixing shaft is rotatably connected in the material pipe 6, and the bottom end of the screw mixing shaft is fixedly connected with the spray pipe 8. The spray pipe 8 is connected with the mixing pipe 6 in a sealed rotation. The port 81 is communicated with the nozzle 10 which is axially slidably connected on the nozzle 8. The top of the nozzle 10 is connected with a limit rod 12, and the limit rod 12 is slidably connected with the limit plate 7 fixedly connected to the outside of the mixing pipe 6. The bottom of the limit plate 7 A spiral limiting groove 71 is arranged on the side, a stage 11 is arranged below the...

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Abstract

The invention provides a ceramic particle wet spraying device for surface treatment of electronic materials and a spraying method thereof, and relates to the field of electronic material surface treatment. The connecting pipe is communicated with the mixing pipe, the mixing pipe is rotatably connected with a screw mixing shaft, the bottom end of the screw mixing shaft is fixedly connected with the spray pipe, the spray pipe and the mixing pipe are sealed and rotatably connected, and the spray pipe is connected to the mixing pipe. A material guide port is arranged on the pipe, and the material guide port is communicated with the spray head which is axially slidably connected on the spray pipe. The top of the spray head is connected with a limit rod, and the limit rod is fixedly connected with the limit plate outside the mixing pipe. Sliding connection, the bottom side of the limit plate is provided with a spiral limit groove, and a stage is provided under the nozzle. Making the nozzle spray the ceramic particles along the spiral trajectory can make the ceramic particles spray evenly.

Description

technical field [0001] The invention relates to the field of electronic material surface treatment, in particular to a ceramic particle wet spraying device for electronic material surface treatment and a spraying method thereof. Background technique [0002] Ceramic materials mostly have ionic bond and covalent bond structure, high bond energy, strong interatomic bonding force, low surface free energy, small atomic spacing, dense packing, and no free electron movement. These characteristics endow ceramic materials with high melting point and high hardness. , high stiffness, high chemical stability, high insulation and thermal insulation performance, low thermal conductivity, small thermal expansion coefficient, small coefficient of friction, no ductility and other distinctive characteristics, thermally sprayed insulating ceramic coating on metal plates, with high thermal conductivity The high-efficiency metal can dissipate the heat generated by the strong current, while the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B13/02B05B13/04B05B15/25B05B9/047
CPCB05B13/0221B05B13/04B05B15/25B05B9/047Y02E60/10
Inventor 钱云
Owner 翰贝摩尔表面技术(江苏)有限公司
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