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Ceramic copper-clad plate, preparation method thereof and ceramic circuit board

A ceramic copper clad laminate and ceramic substrate technology, which is applied in the direction of circuit substrate materials, printed circuit precursors, printed circuits, etc., can solve the problems of aggravating copper layer cracks and warping and peeling, so as to improve easy warping and peeling, improve copper Layer cracks, the effect of improving electrical conductivity and reliability

Pending Publication Date: 2021-04-30
SONGSHAN LAKE MATERIALS LAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the ceramic substrate and the conductive copper plate are generally bonded directly at high temperature to form a ceramic copper clad laminate. -6 / K, Ceramic 3~8×10 -6 / K) is large, and the interface of the ceramic copper clad laminate will generate thermal stress, which will aggravate the cracks of the copper layer and the reliability problems of warping and peeling.

Method used

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  • Ceramic copper-clad plate, preparation method thereof and ceramic circuit board
  • Ceramic copper-clad plate, preparation method thereof and ceramic circuit board
  • Ceramic copper-clad plate, preparation method thereof and ceramic circuit board

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preparation example Construction

[0035] In a second aspect, the embodiment of the present application provides a method for preparing a ceramic copper clad laminate 10, comprising: directly bonding the ceramic substrate 11 and the conductive copper plate 12 under heating conditions.

[0036] The ceramic copper clad laminate 10 obtained by bonding the ceramic substrate 11 and the conductive copper plate 12 under heating conditions, since the conductive copper plate 12 includes a single crystal domain copper layer 121, and the copper in the single crystal domain copper layer 121 is single crystal domain copper, There is no grain boundary in each single crystal domain, which can significantly improve the problems of cracks and warping and peeling of the copper layer in the ceramic copper clad laminate 10 , and can improve the electrical conductivity of the ceramic copper clad laminate 10 . Exemplarily, the heating temperature during bonding is 1050-1100°C, such as any one of 1050°C, 1060°C, 1070°C, 1080°C, 1090°C...

Embodiment 1

[0047] This embodiment provides a ceramic copper-clad laminate, which includes a laminated ceramic substrate and a conductive copper plate, one side of the ceramic substrate is provided with a conductive copper layer, and its preparation process includes:

[0048] The polycrystalline copper plate with a thickness of 50um is annealed for the first time under the condition of 1050°C to obtain a single crystal domain copper layer, and the single crystal domain copper layer is electroplated and thickened to form a thickness of 200um on the surface of the single crystal domain copper layer. The copper layer is then annealed for the second time under the condition of 700° C. to obtain a conductive copper plate with a single crystal domain copper layer and an annealed electroplated copper layer.

[0049] The conductive copper plate is bonded to a ceramic substrate with a thickness of 200 um at a temperature of 1050° C. and the single crystal domain copper layer is in contact with the ...

Embodiment 2

[0051] This embodiment provides a ceramic copper-clad laminate, which includes a laminated ceramic substrate and a conductive copper plate. Both sides of the ceramic substrate are provided with conductive copper layers. The preparation process includes:

[0052] The polycrystalline copper plate with a thickness of 75um is annealed for the first time under the condition of 1000°C to obtain a single crystal domain copper layer, and the single crystal domain copper layer is thickened by electroplating, and then electroplated copper with a thickness of 400um is formed on the surface of the single crystal domain copper layer 121 layer, and then perform a second annealing at 800°C to obtain a conductive copper plate with a single crystal domain copper layer and an annealed electroplated copper layer.

[0053] The conductive copper plate is bonded to the ceramic substrate with a thickness of 400 um at a temperature of 1050° C. so that the single crystal domain copper layer is in conta...

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Abstract

The invention discloses a ceramic copper-clad plate, a preparation method thereof and a ceramic circuit board and belongs to the technical field of copper-clad plates. A conductive copper plate is arranged on at least one side of the ceramic substrate and comprises a single crystal domain copper layer; the single crystal domain copper layer has no grain boundary, and still has high single crystal orientation and high conductivity after being subjected to electrocoppering thickening and secondary annealing treatment. The ceramic copper-clad plate is formed by directly bonding the ceramic substrate and the conductive copper plate at a high temperature, so that the problems of cracks, warping and stripping of a conductive copper layer of the ceramic circuit board can be remarkably improved, the conductivity and the reliability are improved, and the performance requirements of the fields of high-current power modules, power electronic components and the like are better met.

Description

technical field [0001] The present application relates to the technical field of copper clad laminates, in particular, to a ceramic copper clad laminate, a preparation method thereof, and a ceramic circuit board. Background technique [0002] Compared with organic copper clad laminates, ceramic copper clad laminates have better thermal stability, dimensional stability and heat dissipation. In the prior art, the ceramic substrate and the conductive copper plate are generally bonded directly at high temperature to form a ceramic copper clad laminate. -6 / K, Ceramic 3~8×10 -6 / K) is large, thermal stress will be generated at the interface of the ceramic copper clad laminate, which will aggravate the cracks of the copper layer and the reliability problems of warping and peeling. Contents of the invention [0003] The present application provides a ceramic copper-clad laminate, a preparation method thereof, and a ceramic circuit board, which can improve the problems of cracks...

Claims

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Application Information

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IPC IPC(8): H05K1/03H05K1/09H05K1/02H05K3/02H05K3/06
CPCH05K1/02H05K1/0306H05K1/09H05K3/022H05K3/06
Inventor 刘科海张志强寇金宗丁志强陈益王恩哥
Owner SONGSHAN LAKE MATERIALS LAB