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SMT element mounting method and circuit board

A component and patch technology, applied in the field of SMT component patch method and circuit board, can solve the problems of easy overflow of glue and easy damage of SMT components, so as to avoid the overflow of glue and avoid bumps and impacts.

Pending Publication Date: 2021-04-30
昆山丘钛光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of this, the purpose of the embodiment of the present invention is to provide a SMT component placement method and a circuit board to solve the problems that the glue overflows easily and the SMT components are easily damaged in the circuit board manufactured in the SMT assembly process in the prior art.

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  • SMT element mounting method and circuit board
  • SMT element mounting method and circuit board
  • SMT element mounting method and circuit board

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specific Embodiment

[0032] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations. Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without cre...

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Abstract

The embodiment of the invention provides an SMT (Surface Mount Technology) element mounting method and a circuit board. The method comprises the following steps: determining a pressing area on a board; performing solder mask treatment on the area outside the pressing area of the board; performing PP lamination in the pressing area to form a hollow area; and fixing an element patch in the hollow area. According to the invention, problems that glue is easy to overflow and SMT elements are easy to damage in a circuit board manufactured by an SMT assembly process in the prior art are solved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to an SMT component patching method and a circuit board. Background technique [0002] SMT (Surface Mounted Technology, Surface Mount Technology) is a surface composition technology, which is a method of mounting non-pin or short-lead surface mount components on the surface of a PCB (Printed Circuit Board, printed circuit board) or other substrates. , and then soldered and assembled circuit connection technology by methods such as flow soldering or dip soldering. At present, in the actual production process on the SMT production line, operations such as pick-and-place and transfer of materials will be involved. The staff are all different individuals, and it is difficult to achieve standard and unified pick-and-place, so it is easy to cause the patch components on the PCB surface to be touched during actual operation, resulting in the risk of instability...

Claims

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Application Information

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IPC IPC(8): H05K3/30H05K3/34H05K1/18
CPCH05K1/181H05K3/303H05K3/341
Inventor 刘娟赵肖强
Owner 昆山丘钛光电科技有限公司
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