LED lamp bead with built-in drive IC

Abstract

The invention discloses an LED lamp bead with a built-in drive IC. The LED lamp bead comprises a PCB, a colloid, an IC wafer, pins, an LED wafer and insulation paste. The PCB is connected with the colloid, the LED wafer is arranged on the PCB, and the LED wafer is connected with the PCB through the insulation paste; the LED wafer is arranged on the front surface of the PCB and comprises a red LED wafer, a green LED wafer and a blue LED wafer, and the red LED wafer, the green LED wafer and the blue LED wafer are linearly arranged; the IC wafer is arranged on the back face of the PCB, the pins are connected with the PCB, and the pins comprise outwards-turned pins. According to the invention, the LED lamp bead with the built-in drive IC is low in power consumption, prevents heat focusing, improves the product quality, reduces the process difficulty and improves the brightness of the LED lamp bead.

Description

technical field [0001] The invention relates to the technical field of LED lamp beads, in particular to an LED lamp bead with a built-in driver IC. Background technique [0002] The existing developed integrated IC and LED chip (LED chip) packaged LED lamp beads can be widely used in the fields of lighting, LED display screen, flexible display film, and LCD backlight. [0003] The existing LED lamp beads with a built-in IC are basically packaged in a front-mounted way where the IC and the LED chip (LED chip) are on the same side. There are mainly the following problems in this way: [0004] 1. There are many components arranged on the same surface, and the layout and process are difficult; [0005] 2. There is a large difference between the size of the IC wafer and the size of the LED chip, and the size of the IC wafer is much larger, which affects the light-emitting viewing angle of the LED chip. [0006] 3. The IC chip drive adopts the common anode mode, which consumes ...

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Problems solved by technology

[0004] 1. There are many components arranged on the same surface, and the layout and process are difficult;

[0005] 2. There is a large difference between the size of the IC wafer and the size of the LED chip, and the size of the IC wafer is much larger, which affects the light-emitting viewing angle of the LED chip

[0006] 3. The IC chip drive adopts the common anode mode, which consumes more power and generates heat (the reason for the voltage distribution leading to the LED chip and the voltage drop causes a lot of waste of electric energy)

[0009] The above-mentioned patent document discloses an LED lamp bead with a built-in IC, but the layout and process of the LED lamp bead are difficult; it affects the light-emitting angle of the LED chip, generates a lot of heat, and consumes a lot of power, which cannot meet the needs of consumers.

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