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Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound

A technology of dicarbonyl compounds and compositions, applied in the direction of non-polymer organic compound adhesives, adhesives, semiconductor/solid-state device manufacturing, etc., to achieve the effect of preventing outgassing

Active Publication Date: 2021-05-11
NAMICS CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a two-liquid mixing type curable composition comprising such a methylene malonate monomer as a curing agent is unknown

Method used

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  • Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound
  • Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound
  • Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0173] Hereinafter, examples and comparative examples of the present invention will be described. The present invention is not limited to the following Examples and Comparative Examples. In the following examples and comparative examples, the amounts of components contained in the compositions and adhesives are represented by mass (unit: g).

[0174] [Calculation of Vapor Pressure]

[0175] For the 2-methylene-1,3-dicarbonyl compound used in the present invention, the vapor pressure at each temperature was calculated using HSPiP (5th edition 5.0.04Y-MB method). Table 1 shows information about diethyl methylene malonate (DEMM), ethyl propyl methylene malonate (EPrMM), dipropyl methylene malonate (DPrMM), methylene Butylpentylmalonate (BPeMM), Dipentylmethylenemalonate (DPeMM), Dihexylmethylenemalonate (DHMM) and Dicyclohexylmethylenemalonate (DCHMM) Vapor pressure (unit: mmHg) at each temperature.

[0176] [Table 1]

[0177]

[0178] [Preparation of curing agent compositi...

Embodiment 5

[0206] The operation similar to Example 4 was performed except having made the mass of a hardening|curing agent composition 1.51g and the mass of a component (b2) 1.49g. The gel time was about the same as in Example 4.

Embodiment 6

[0208] The same operation as in Example 4 was performed except that the mass of the curing agent composition was 1.49 g and the mass of the component (b2) was 1.51 g. The gel time was about the same as in Example 4.

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Abstract

The purpose of the present invention is to provide a curing agent capable of curing a main agent containing a 2-methylene-1,3-dicarbonyl compound without difficulty, a two-liquid-mixing type adhesive using the same, etc. The present invention provides: a curing agent composition containing a specific 2-methylene-1,3-dicarbonyl compound and an initiator; a two-liquid-mixing-type adhesive formed of a main agent containing the curing agent composition and another specific 2-methylene-1,3-dicarbonyl compound; and a method for curing another specific 2-methylene-1,3-dicarbonyl compound using the two-liquid-mixing-type adhesive.

Description

technical field [0001] The present invention relates to a curing agent composition comprising a specific 2-methylene-1,3-dicarbonyl compound, a bismuth containing the curing agent composition and other specific 2-methylene-1,3-dicarbonyl compounds A liquid-mixing adhesive and a method for curing other specific 2-methylene-1,3-dicarbonyl compounds using the curing agent composition. Background technique [0002] Currently, in the assembly and mounting of electronic components used in semiconductor devices, for the purpose of maintaining reliability and the like, adhesives, sealing materials, and the like containing curable compositions are often used. Among semiconductor devices, especially electronic devices such as mobile phones and smartphones are composed of various electronic modules such as cameras, displays, speakers, sensors, batteries, and vibrators. The components constituting these electronic modules are mostly made of materials whose mechanical / electronic charact...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F22/14C09J4/00
CPCC09J4/00C08F122/14C08F222/14H01L21/56H01L23/295C08F22/14C08F2/38C08K5/109C08F2/44C08K5/17
Inventor 新井史纪
Owner NAMICS CORPORATION
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