Base with coil, periscopic voice coil motor and manufacturing method thereof

[0047]In the description of the present invention, it is to be noted that the orientation or positional relationship of the term "upper", "lower", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, is only for It is convenient to describe the present invention and simplified description, rather than indicating or implying that the device or component must have a specific orientation, and is not understood to limit the limitation of the invention.

[0048]In the description of the present invention, it is to be explained, unless otherwise expressly specified and defined, the term "connection" should be broadly understood, and will be appreciated to those skilled in the present invention, unless otherwise expressly specified and defined. The specific meaning.

[0049]The prior art bonding tone motor needs to be subsequent integration with the coil, generally need additional installation or flexible circuit board (FPC) of the coil, and then position the flexible circuit board to assemble Overall voice coil motor. The base of the integrated coil of the present invention does not require additional setting of the flexible circuit board to the transfer and positioning, while the assembly and component set space of the subsequent assembly manufacturer when the injection base is molded. Moreover, in the prior art, if the coil row or mounting of the upper surface of the base after the molding is required, it is limited to a limited winding space or operating space inside the susceptor, which is not conducive to the assembly of the base and the coil. integrated. Specifically, the integrated coil and the electronic component are in the horizontal plane of the base, and the coil or electronic component is wound or mounting the coil or electronic component in the insulating base within the vertical portion in the premise of the vertical portion. The operating space is limited, and the positioning integration is very difficult, and the processing integration is limited to single-chip base and single coil or electronic component, the integration efficiency is low, which is not conducive to the reduction and efficiency of the cost of automated mass production.

[0050]In the present invention, an insulating base 2 is formed by injection molding in the horizontal plane of the metal circuit 1, and then electrically assembles the electronic component 5 and the coil 4 or attached to the insulating base 2, and then the insulating base 2 The vertical portion (vertical column portion 19d) of the metal circuit 1 is bent, and the secondary injection molding is performed in the outer circumferential side surface 29 of the insulating base 2 to form an insulating frame 3, and the vertical portion (vertical column 19d) is buried. It is molded in the insulating frame 3. The electronic component 5 in the present invention completes the electron element 5, the electrical welding of the coil 4 and the metal circuit 1 before the coil 4, and no need to adopt a flexible circuit board (FPC) and the coil. After injection molding, the subtraction is again assembled, making the assembly cost decrease, improvement rate increases; at the same time solves the difficulty of the contained hollow coil 4 and electronic components 5 in the vertical portion 31 premise the difficulty of the installed difficulty (Electrically mount is only suitable for space-free space for vertical opening, which is not conducive to the use of mounting mode when the two mount faces are parallel to the vertical direction. Sexual assembly, it is forced to use only manual ways), which helps to improve the degree of freedom of internal space design of the diving voice coil motor 1000, and the internal structure of the diving voice coil motor product is also more compact and miniaturized. Hereinafter, it will be combinedFigure 1 to 9This paper introduces the base 100 of the present invention and a baked voice coil motor 1000 having the base 100 and its manufacturing method.

[0051]In the present invention, the base 100 and the bosurial sound coil motor 1000 can be applied to the diving imaging module in the mobile phone. Due to the limitation of the thickness of the mobile phone, it is arranged in conventional vertical place (i.e., towards the outside of the mobile phone), due to the smaller mobile phone camera, the optical zoom capacity is limited, and in the present invention, the vertical arrangement of the conventional lens is different. The diving voice coil motor 1000 is placed laterally in the phone, such asfigure 1 Indicated. A baked voice coil motor 1000 includes a photosensitive assembly 1001, an optical lens 1002, a magnetic element (not shown), which is protected from the optical lens 1002, and a reflective element 1003 and an integrated have each other. The base 100 of the active coil 4 and the moving lens holder (not shown) of the movable moving circuit 1, the coil 4, and the magnetic element. The optical lens 1002 is located between the photosensitive assembly 1001 and the reflective element 1003 such that the ambient light is reflected by the reflective element 1003 to change the propagation direction of the ambient light (incident in the vertical direction of the mobile phone camera). The light in the lateral direction is received after passing through the optical lens 1002, and the image is collected by the photosensitive assembly 1001. The reflective element 1003 may be a prism or a lens, which is not limited. The metal circuit 1 can interact with the magnetic element after power-on to drive the lens bracket to assist the optical lens 1002 to focus. Hereinafter, a detailed description will be made.

[0052]In the prior art, a side of the base 100 carrying the optical lens 1002 has a hollow coil which is provided on a flexible circuit board, thereby interacting with the magnetic element to facilitate the optical lens. Regulate. In the present invention, the coil 4 is integrated on the base 100. At the same time, the magnetic element in the present invention can interact with the coil 4 to achieve the movement of the horizontal surface (X-axis or Y-axis direction) or the movement of the vertical direction (direction), which is not limited herein. The form of the coil may employ a hollow coil 4 or a patch type flexible circuit coil (FP Coil) 4 ', etc., the form of the specific coil is not limited in the form of the present invention, but the optimal mode of the present invention is in Line or patch flexible circuit coil. Such asfigure 2 The sticker flexible circuit coil 4 ', such asimage 3 The displayed circuit coil 4 is shown.

[0053]Please refer toFigure 1 to 9The base 100 includes a rectangular insulating base 2, a metal circuit 1 having a molded article 2, electrically connected to the electron component 5 and a coil 4 (flexible circuit coil 4 ') electrically connected to the metal circuit 1. ) And an insulating frame 3 outer in the insulating base 2. The insulating base 2 is arranged horizontally and has an outer peripheral side surface 29 and an upper surface 20 disposed at the outer circumference. The insulating frame 3 is located outside the outer circumferential side surface 29 of the insulating base 2. The insulating base 2 is located in a first plane P1. The insulating base 2 is covered with the metal circuit 1 by one injection molding, and the coil 4 is disposed on the upper surface 20 of the insulating base 2, the base 100 comprising a secondary injection molding. The insulating frame 3 of the insulating base 2 and the metal circuit 1 is covered with an integrally closed wall portion 30 and a horizontal frame portion 30 and a horizontal frame portion 30 and A vertical portion 31 that extends around the upper surface of the upper surface of the frame portion 30. The insulating base 2 is integrated with the insulating frame 3 by secondary injection molding. The metal circuit 1 is filled into the insulating base 2 by one injection molding. In the present invention, the first plane P1 is a horizontal plane.

[0054]Please refer toFigure 5 The insulating base 2 is a rectangular arrangement having a relatively disposed first side 21 and the third side edge 23 and the second side edge 22 and the second side edge 22 of the third side edge 23 and the first side. Side 24. The insulating base 2 has the outer peripheral side 29 and a surface exposed to the insulating frame 3. In the present invention, the outer peripheral side surface 29 is a side surface corresponding to the first side 21, the second side edge 22, the third side 23, and the fourth side 24, in other embodiments, the outer circumferential side surface 29 In order to contact the insulating frame 3. In the present invention, the surface is an upper surface 20 of the insulating base 2, in other embodiments, the surface may be other surfaces exposed to the insulating frame 3. The coil 4 is positioned on the insulating base 2 and is fixed to the insulating base 2 by a winding manner. In the present invention, the base 100 is provided with two of the coils 4 for interacting with the magnetic element, and the two coils 4 are adjacent to the first side 21 and The second side edge 22 is provided, and the longitudinal direction of the two coils 4 is perpendicular to each other. The insulating base 2 includes a pair of winding posts 26 disposed at the extended direction of the first side 21 and the second side edge 22, a pair of positioning posts 27 located inside the two windings 26 and The weld groove 28 between each winding post 26 and the same side of the corresponding positioning post 27. A plurality of solder recess 25 is further provided on the insulating base 2 for exposing the solder pin 1b of the metal circuit 1 such that it is welded to the electronic component 5. In the present invention, the base 100 has three electronic components 5.

[0055]The insulating frame 3 is a secondary injection molded formed in the insulating base 2 to be connected to the insulating base 2. The insulating frame 3 includes a horizontally disposed vertical portion 31 extending vertically disposed from the upper surface P1 disposed from the upper surface of the frame portion 30 and the vertical portion 31 located and located in the vertical The top surface 32 of the surface of the straight portion 31. The insulating frame 3 is formed integrally, and has a thin portion 33. The thin portion 33 is formed on one side of the frame portion 30, in the present invention, the thin portion 33, corresponding to the first side 21. The pin 1a described below is exposed to the surface of the thin portion 33. Since the insulating frame 3 is formed, the base 100 after the injection molding is better than that of the injection molding. And after the thin portion 33 is thinner, it is more likely to be mounted on an external circuit board (not shown), and does not increase its thickness space after installation. The vertical portion 31 includes a first vertical portion 311 located at the intersection of the first side 21 and the second side 22, located at the first side 21 and the fourth side 24 The second vertical portion 312 provided in the intersection is located at the third vertical portion 313 disposed at the intersection of the fourth side 24 and the third side 23 and the second side 22 and the first The fourth vertical portion 314 set by the three-side edge 23 intersection.

[0056]The metal circuit 1 is a metal circuit disposed along a double layer in a first direction, which is an upper metal circuit 1D and a lower metal circuit 1e.Figure 9. In the present invention, the first direction is a vertical direction perpendicular to the first plane P1. In other embodiments, it can also be other directions. The metal circuit 1 includes a horizontal portion of the insert molded in the insulating base 2 and a vertical portion in which a mating is formed in the insulating frame 3, the horizontal portion and the vertical portion is bent and form a fold The bend 194, the bending portion 194 is housed in the insulating frame 3. The vertical portion of the metal circuit 1 is inserted into the insulating frame 3.

[0057]The metal circuit 1 includes a plurality of branches, including a plurality of horizontal branches 10, and at least two column branches on the 10 weeks of the plurality of horizontal branches. Road 19. One end of the plurality of the horizontal branch 10 is arranged in parallel to form a pin 1a exposed to the insulating base 2, and the other end of the horizontal branch 10 is electrically connected to the electronic component 5. The solderi 1b of the pin is formed between the welding pins 1b of each of the horizontal branch 10 and the pin 1a. The horizontal branch 10 includes the first road 11, the second road 12, the third branch 13, the fourth road 14, the fifth road 15, the sixth road 16, The seventh branch 17 and the eighth road 18. The first branch 11, the fifth branch 15, and the eighth branch 18 constitute the upper layer metal circuit 1D, the second road 12, the third branch 13, the fourth road 14 , The sixth path 16, the seventh branch 17, and the column branch 19 constitute the lower layer metal circuit 1e located in the lower layer. Both the upper layer metal circuit 1D is provided with a bent portion 1f between the connecting portions 1c, such that the solder pins 1b of the upper metal circuit 1d and the lower metal circuit 1e are located in the same Planar is soldered to the same electronic component 5. In the present invention, the horizontal branch 10 forms a portion of the horizontal portion of the metal circuit 1.

[0058]In the present invention, the base 100 has three of the column branch 19. Each of the column branch 19 includes the horizontal portion and the vertical portion, the vertical portion of the column branch 19 distributes the outer circumference of one side of the insulating base 2, and the electronic component 5 is The coil 4 is disposed at at least two horizontal portions between the vertical portions of the column branch 19. Specifically, one end of the column branch 19 is provided with a column pin 19a exposed to the top surface 32 of the insulating frame 3, and the other end is arranged to form a column welding foot 19b, which is welded to the electronic component 5. The column pin 19a is formed between the horizontal branch 10-weeks 19c between the horizontal branch 10 weeks and the column welding pin 19b. The vertical pillar portion 19d is perpendicular to the first plane P1 and is located outside the insulating base 2, and is located in the insulating frame 3, the vertical column portion 19d and the first plane P1. The attachment of the column connecting portion 19c is bent to form the bend 194. The column branch 19 includes a first column branch 191 disposed at the first side 21 and the second side 22, located in the second column branch 192 set by the fourth side 24. The third column branch 193 provided at the intersection of the second side 22 and the third side 23. At this time, the vertical column portion 19d is located outside the insulating base 2 and is located within the vertical portion 31 of the insulating frame 3.

[0059]Specifically, the horizontal portion of the metal circuit 1 is the horizontal branch 10 and the column welding foot 19b of the column branch 19 and constitutes a portion of the column connecting portion 19c in the first plane P1. The vertical portion of the metal circuit 1 is constituted by the vertical column portion 19d of the column branch 19 and the column pin 19a. The horizontal portion is mounted to the insulating base 2, the vertical portion is buried into the insulating frame 3, and the valve portion 194 between the vertical portion and the horizontal portion is located at the insulating base 2. Futured inserted into the insulating frame 3.

[0060]The column branch 19 is included in one of the upper metal circuit 1d and the lower metal circuit 1e, in the present invention, the column branch 19 is part of the lower metal circuit 1e, in other embodiments The column branch 19 can also be part of the upper metal circuit 1D, or consist of a portion of the upper metal circuit 1d and the lower metal circuit 1e.

[0061]The first branch 11 includes a first pin 11a of the first side 21 and the fourth side edge 24, of the insulating base 2, welded to the electronic component 5. The pin 11b is connected to the first connecting portion 11c of the first solder pin 11b and the first pin 11a and the first bending of the first connecting portion 11c on the first welding pin 11b. Ministry 11f.

[0062]The second branch 12 includes a second pin 12a, which is welded to the same electronic component 5 and its second solder foot 12b located on the same plane, and the first solder tip 11b. The second connecting portion 12c of the second pin 12a is connected to the second solder pin 12b. The first solder pin 11b is located in different two rows of the second solder pin 12b, but co-welded to the same electronic component 5.

[0063]The third branch 13 includes a third pin 13a located in the first side 21, welded to the same electronic component 5 with the first solder pin 11b and is located at the same plane. A third connecting portion 13c coupled between the third pin 13a and the third solder pin 13b. The third solder pin 13b is located at the same row of the right side of the second solder pin 12b and is disposed relative to the first solder pin 11b.

[0064]The fourth branch 14 includes a fourth pin 14a at the first side 21, and is soldered to the same electronic component 5 with the first solder pin 11b and its fourth welding pin 14b located on the same plane. A fourth connection portion 14c coupled between the fourth pin 14a and the fourth solder pin 14b. The fourth solder pin 14b is located at the same row of the left side of the first solder pin 11b and is disposed relative to the second solder pin 12b.

[0065]One of the electronic components 5 has four pins, and welded to the first solder tip 11b, the second solder tip 12b, the third solder pin 13b, and the fourth solder pin 14b. The first bending portion 11f enables the first solder pin 11b to the second solder pin 12b, the third solder pin 13b, and the fourth solder pin 14b on the same plane.

[0066]The fifth branch 15 includes two fifth pins 15a located at the first side 21 of the insulating base 2, and welded to different from the first solder pin 11b. The fifth welding pin 15b of the electronic component 5 is connected to the fifth connecting portion 15c between the fifth solder pin 15b and the fifth pin 15a and a connection located inside the fifth sheet 15b. The fifth bending portion 15f of the fifth connecting portion 15c is described.

[0067]The sixth path 16 includes two sixth pin 16a located at the first side 21 and the third side edge 23 of the insulating base 2, welded to the same as the fifth sheet 15b. The sixth sheet 16b of the electronic component 5 and the sixth connecting portion 16c connected between the sixth sheet 16b and the sixth pin 16a. The sixth sheet 16b is disposed relative to the fifth solder pin 15b.

[0068]The seventh branch 17 includes a seventh pin 17a of the first side 21 of the insulating base 2, and is welded to the fifth welding of the same electronic component 5 with the fifth solder pin 15b. The seventh sheet 17b on the right side of the foot 15b, the other seventh welding of the electronic component 5 welded to the first solder pin 11b and the fifth solder pin 15b. 17b and the seventh connection portion 17c of the seventh sheet 17b and the seventh pin 17b are connected to the seventh pin 17b.

[0069]The eighth branch 18 includes a total of two, one of the second side edges 22, one and the fourth sides 24 of the third side edge 23, of the first side 2, and the fourth side 23 of the third side 23. The eighth pin 18a is welded to the eighth solder pin 18b opposite the seventh sheet 17b opposite the same electronic component 5 with the fifth solder pin 15b, and welded to the other seventh sheet 17b. Another eighth solder pin 18b of the same electronic component 5, which is connected to the eighth connecting portion 18c of the eighth solder pin 18b and the eighth pin 18a, and connected within the eighth sheet 18b. The eighth bending portion 18f of the eighth connecting portion 18c. The seventh branch 17 has two of the seventh sheets 17b, which has two of the eighth solder pins 18b. The eighth rail 18 has two of the eighth bending portions 18f such that the eighth solder pin 18b and the fifth solder pin 15b and the seventh sheet 17b are located on the same plane to welding The same electronic component 5. The arrangement of the fifth bending portion 15f is also intended to make the fifth solder pin 15b and other solder pins soldered thereto to the same electronic component 5 on the same plane.

[0070]The electronic component 5 soldered to the fifth sheet 15b has six pins, and the solder pins 1b soldered therefrom is the fifth welding foot 15b, the sixth sheet 16b, the seventh sheet 17b and the eighth sheet 18b. Further, the other two solder pins 1b respectively, respectively, the first column welding foot 191b of the first column branch 191, respectively, of the third column branch 193, respectively, is provided with the first column welding foot 191b, respectively. 193b.

[0071]The third electronic component 5 has two pins, which are welded to the other seventh sheet 17b and the eighth solder pin 18b. Each of the electronic components 5 is welded to the position of the welding pin being provided with a welded groove 25 at the insulating base 2.

[0072]In the present embodiment, there are three electronic components 5. The number of electronic components 5 affects the number and arrangement of the horizontal branch 10 and the column branch 19. The first pin 11a, the second pin 12a, the third pin 13a, the fourth pin 14a, the fifth pin 15a, the sixth pin 16a, the seventh pin 17a, the eighth lead 18a Pin 1A.

[0073]The first solder pin 11b, the second solder pin 12b, the third solder pin 13b, the fourth welding pin 14b, the fifth welding pin 15b, the sixth sheet 16b, the seventh welding foot 17b and the eighth sheet 18b The solder pin 1b is called the solder pin.

[0074]The first connecting portion 11c, the second connecting portion 12c, the third connecting portion 13c, the fourth connecting portion 14c, the fifth connecting portion 15c, the sixth connecting portion 16c, the seventh connection portion 17c, and the eighth connecting portion 18C The connecting portion 1c is called

[0075]The first bending portion 11f, the fifth bending portion 15f, and the eighth bending portion 18f are both a bent portion 1f.

[0076]The first column branch 191 includes a first vertical column 191d inserted into the first vertical portion 311, exposed from the end of the first vertical pillar portion 191d to the first The first column pin 191a of the top surface 32 of the vertical portion 311, welded to the first column welding pin 191b of the same electronic component 5 and connected to the first column with the fifth solder pin 15b. The first column connecting portion 191c between the pin 191a and the first column solder foot 191b. The first vertical pillar portion 191d is provided with a bent portion 194 perpendicular to the first plane P1. The first vertical pillar portion 191d is formed perpendicularly in the first pillar connecting portion 191c located within the first plane P1, and has the bent portion 194. The bending portion 194 is located in the insulating base 2 within the insulating frame 3. In the present invention, the first column connecting portion 191c is at least one of the two insulating base 2 and the insulating frame 3, in other embodiments, only the vertical column 19d is required to The bend 194 is placed in the insulating base 2 and is within the insulating frame 3, and the column connecting portion 19c may be located in the insulating base 2 in the insulating frame 3, which is not limited thereto. In the present invention, the first pillar connecting portion 191c is located in the insulating base 2 and within the insulating frame 3.

[0077]The second pillar branch 192 includes two second vertical column 192d reaches the second vertical portion 312 and the third vertical portion 313, from the second vertical column portion 192D. The end upward extension exposed to the second vertical pins 192a of the top surface 32 of the second vertical portion 312 and the third vertical portion 313 and two of the second vertical column 192d The second column connection portion 192c is between. At this time, the second pillar connection portion 192c is located outside the insulating base 2 and is located in the insulating frame 3. The second vertical pillar portion 192d is formed perpendicularly in the second column connecting portion 192c located within the first plane P1, and has the bent portion 194. The bending portion 194 is located in the insulating base 2 within the insulating frame 3.

[0078]The third column branch 193 includes a third vertical column portion 193d in which the fourth vertical portion 314 is retained from the end of the third vertical column portion 193d, which is exposed to the fourth vertical. The third column pin 193a of the top surface 32 of the straight portion 314, welded to the third column welding feet 193b of the same electronic component 5 and connected to the third column pin with the fifth solder pin 15b. 193A and the third column connection portion 193c between the third column welding pins 193b. The third vertical column portion 193d is provided with a bent portion 194 perpendicular to the first plane P1. The third vertical column portion 193d is perpendicular to the third column connecting portion 193c in the first plane P1, and has the bent portion 194. The bending portion 194 is located in the insulating base 2 within the insulating frame 3. In the present invention, the third pillar connecting portion 193c is located in the insulating base 2 and within the insulating frame 3.

[0079]The first vertical column portion 191d, the second vertical column portion 192d, and the third vertical column portion 193d are both a vertical column 19d.

[0080]The first column pin 191a, the second column pin 192a, and the third column pin 193a are both called a column pins 19a.

[0081]The first column solder foot 191b and the third column welding feet 193b are both a column welding foot 19b.

[0082]The first column connecting portion 191c, the second column connecting portion 192c, and the third column connecting portion 193c are each referred to as a post connecting portion 19c.

[0083]The first side 21 of the insulating base 2 and the second side 22 average spacer respectively dispose of two weld grooves 28 to expose two intervals of the bracket 1G, the coil 4. Two welding pin 41, two of said welding pins 41 respectively correspond to two of said weld grooves 28 of said insulating base 2 to be soldered to said branch. The weld position 1G can be disposed in different branches, in the present invention, one pair of weld position 1g is disposed in different branches, and another pair of soldering 1g is disposed on the same branch . Specifically, the welding position 1g corresponding to the coil 4 located at the first side portion 21 is located on the second connecting portion 12c of the second branch 12 and the sixth connection portion 16c of the sixth path 16. The welding position 1g corresponding to the coil 4 of the second side 22 is located on the first column connection portion 191c of the first column branch 191. In other embodiments, the welding position 1g corresponding to the two welding pin 41 can also be protruded from the insulating base 2 and is directly exposed to the surface of the insulating base 2, i.e., no need to provide the weld groove 28.

[0084]In the present invention, the coil 4 is maintained in such a manner of the insulating base 2, and the winding of the coil 4 is to be wound or select the SMT (SURFACE MOUNT TECHNOLOGY) mounting coil. When the first mode is selected, the weld groove 28 needs to provide a winding post 26 and a positioning post 27 on the insulating base 2, but the number of winding column 26 and the positioning post 27 is not limited, according to the product needs . If a second mode is selected, no needle column 26 and the positioning post 27 are required. However, in two ways, it is necessary to provide a welding position 1G such that the coil 4 is welded to the metal circuit 1. In the present embodiment, the coil 4 is fixed to the insulating base 2 by a winding manner, and the first side 21 and the second side 22 of the insulating base 2 are provided with a pair of intervals provided by winding column 26. And the positioning post 27 located below the winding post 26, and the weld groove 28 herein is disposed between the winding post 26 and the positioning post 27. The coil 4 is fixed to a pair of the winding post 26, the coil 4, is also provided with a pair of lead terminals 42, the lead terminal 42 being fixed to the positioning post 27. The welding pin 41 on the lead terminal 42 of the final coil 4 is welded to the welding position 1g exposed to the weld groove 28, and the portion outside the welding pin 41 will be cut off.

[0085]One end side of each of the branches and the coil 4 is injection molded into the insulating base 2. At least two of the coils 4 are located in the same insulating base 2, each of which is independently located on the surface of the insulating base 2.

[0086]Both the electronic component 5 and the coil 4 are located in the same insulation base 2, the electronic component 5 is located in a region where the coil 4 is rotated or in the area where the coil 4 is rotated, and is not limited. In the present invention, since the electronic component 5 has three regions having a region where the coil 4 is disposed, it is also provided in a region where the coil 4 is rotated. The electronic component 5 is attached to the upper surface 20 of the insulating base 2 by surface mounting technique (SMT). The surface mounting technique (SMT) is attached to the printed circuit board here, and the surface mounting technique herein refers to the insulation of the electronic component 5 to the insulation by brazing. The upper surface 20 of the base 2. The arrangement of the electronic component 5 can affect the arrangement of horizontal branch 10 and the column branch 19.

[0087]The invention also relates to a method of manufacturing a base 100 having a coil 4, and specifically comprises the steps of:

[0088]The upper layer metal circuit 1D and the lower layer metal circuit 1e are stacked in the two tapes, and the upper layer metal circuit 1D and the lower metal circuit 1e are stacked to form a number of connected metal circuits 1, the metal circuit 1. Including the horizontal portion of the horizontal plane and a vertical portion located on the outer peripheral side of the horizontal portion, the horizontal plane at this time is the first plane P1, and the horizontal portion of the metal circuit 1 is the horizontal branch 10 and the described. The column welding pin 19b of the column branch 19 is constituted by a portion of the column connecting portion 19c in the first plane P1, the vertical portion of the metal circuit 1 being the vertical portion of the column branch 19. The column portion 19d and the column pin 19a are constituted. The metal circuit 1 includes a plurality of horizontal branches 10 and an outer circumference of the horizontal branch 10, at which time the column branch 19 is located at the same plane at the same plane at which the horizontal branch 10 is located at the same plane. One end of the road 10 is arranged in parallel to form pin 1a, and the other end of the branch is arranged to form a solder pin 1b, and the pin 1a forms a connecting portion 1c between the solder pins 1b, the first The two-connection portion 12c and the sixth connecting portion 16c are provided with spaced welding position 1g; one end of the column branch 19 is formed at the horizontal branch 10 horizontal branch 19a, and the other end is arranged A column joint 19c is formed between the column guide 19a between the same plane from the solder pin 1b, and the column branch 19a is formed between the column welding pins 19b. Another pair of soldering 1g is formed on the first column connecting portion 191c located at the horizontal plane.

[0089]The horizontal portion of the metal circuit 1 performs an injection molding to form a rectangular insulating base 2, at which time the insulating base 2 is arranged horizontally and has an outer circumferential side surface 29 and an upper surface 20 provided in the outer circumference. The vertical portion is located outside the insulating base 2, at which time the column connecting portion 19c is located outside the insulating base 2, the welding 1G is exposed to the upper surface 20 of the insulating base 2, the insulation The base 2 is provided with a welded groove 25 at a position of the welding pin 1b, and a winding post 26 and a positioning post 27 are disposed on the insulating base 2 and between the winding post 26 and the positioning post 27. The weld groove 28 which exposes the weld 1G. The electronic component 5 is attached to the upper surface 20 of the insulating base 2 by surface mounting techniques (SMT) in the welding recess 25 and welded to the solder pins 1b and the column welding foot 19b.

[0090]The insulating base 2 is rotated and positioned horizontally disposed coil 4 or an mounted flexible circuit coil 4 ', the coil 4 includes two welding pin 41, and the two welding pin 41 correspond to the insulating base, respectively. 2 The weld groove 28 is disposed to be set corresponding to the weld 1g exposed to the weld groove 28.

[0091]Bending the horizontal portion of the metal circuit 1 outside the insulating base 2 and the vertical portion of the vertical portion forming a vertical portion provided by a folding portion 194 and a vertical horizontal portion, the vertical portion being the vertical column. The portion 19d and the column pins 19a, thereby forming a first semi-finished product. At this time, the bent portion 194 and the vertical pillar portion 19d are located outside the insulating base 2 with the column pin 19a.

[0092]The secondary injection molding is performed on the first semicredent to form an insulating frame 3, thereby forming a base 100. That is, the secondary injection molding is performed in the periphery of the metal circuit 1 and the insulating base 2 to form an insulating frame 3, and the metal circuit 1 is simultaneously inlaid into the insulating base 2 and an insulating frame 3, the insulating frame 3 A vertical portion 31 that is covered with the outer peripheral side surface 29 of the insulating base 2 and the horizontal portion disposed and the upper surface of the upper surface of the frame portion 30 is vertically extending vertically. The insulating frame 3 covers the column connecting portion 19c and has a vertically disposed vertical portion 31 to embed the vertical column 19d, and the column lead 19A of the vertical column 19d is located in the The top surface 32 of the vertical portion 31 is described. The insulating frame 3 is integrally closed, and has a thin portion 33 corresponding to the first side 2 21, the horizontal branch 10 extends the welding foot 1b of the first side 21. The rank is arranged in addition to the thin portion 33, and the corresponding, the thin portion 33 can be easier to install an external circuit board.

[0093]Cutting the tape in which the tape belt and the horizontal branch 10 of the metal circuit 1 in the metal circuit 1 of the base 100 and the tape at a plurality of independently complete base 100 are formed.

[0094]A method of fabricating a pneumatic voice coil motor 1000 comprising the step of manufacturing a base 100 described above.

[0095]In the present invention, the insulating base 2 and the insulating frame 3 are integrally injection molded by two injection molding, and the coil 4 (flexible circuit coil 4 ') and electronic components are electrically integrated at the insulating base 2 provided in the rectangular shape. 5. Further, the portion of the column support portion 19c located outside the metal circuit 1 is bent, forming a vertical column 19d (vertical portion) perpendicular to the horizontal plane, and then Injection molding insulating frame 3, the insulating frame 3 inserting a portion of the metal circuit 1 is located outside the insulating base 2 and positions the insulating base 2 to achieve the formation of the pneumatic tone motor 1000. Prior to the vertical portion 31 of the base 100, the electrical integration of the first engine coil 4 and the electronic component 5 (surface mount or bypass), no need to perform a single base separately operated flexible circuit board (FPC) The mount assembly of the flexible coil makes the assembly cost, and the improvement rate is improved. At the same time, the coil 4 and the electronic component 5 have a technical problem that the base 100 of the baked voice coil motor 1000 has a vertical portion 31, which can help improve the diving voice coil. The freedom of design of the motor 1000. And since the coil 4 and the electronic component 5 are integrated on the insulating base 2, the structure of the product is more compact. More importantly, since the base 100 is in the horizontal surface of the injection insulating base 2, and after the metal circuit 1 is made after the coil and the electronic component are mounted, a number of bases 100 can be manufactured on the same tape. Batchability can be achieved and automated. Further, the injection molded insulating base 2 is fixed to one end of the branch, that is, the solder pins 1b and the column welding pin 19b and exposed to the upper surface 20, and the insulating frame 3 of the secondary injection molded The other end of the branch is fixed and exposed to the upper surface thereof, and more specifically, the pin 1a is exposed to the upper surface of the housing portion 30 of the insulating frame 3, a column The pin 19a is exposed to the top surface 32 of the vertical portion 31 of the insulating frame 3, so that the manufacturing precision of the base 100 is increased and the manufacturing difficulty of injection molding is reduced.

[0096]It will be noted that the above embodiments are intended to illustrate the technical solutions of the present invention, not to limit the present invention, and will be apparent to those skilled in the art, which will be understood by those skilled in the art. The technical solution described in the foregoing embodiment is modified, or partially or all of the technical features is equivalent to alternative; and these modifications or replacements do not allow the nature of the corresponding technical solution to the scope of the preferred embodiment of the present invention.

[0097]The above embodiments are intended to be described herein, not all of the embodiments of the present invention, and those of ordinary skill in the art will be included in the appended claims. .