Flexible packaging substrate contour, line width and line distance defect detection method, medium and equipment

Abstract

The invention discloses a flexible packaging substrate contour, line width and line distance defect detection method, a medium and equipment, and the method comprises the steps: firstly, selecting a flexible packaging substrate image needing to be detected as an initial guide image, and carrying out texture removal and edge smoothing processing on the initial guide image through variable-scale iteration guide filtering; and processing the filtered image by adopting an adaptive threshold segmentation algorithm improved by an Otsu method to obtain a contour image. According to the method provided by the invention, the problem of inaccurate boundary extraction caused by fuzzy circuit edge of the high-texture flexible packaging substrate is solved by combining the improved guide filtering with the improved edge detection operator, so that the detail information of the image edge can be reserved, the copper surface texture can be eliminated, and the outline of the copper wire area of the substrate can be quickly and accurately extracted. By fitting the straight line and the curve and detecting the line width and the line distance between the contour curves, the detection of the notch defect of the contour curve part can be further solved, and the method has the advantage of simple and rapid fitting of the straight line and the curve part.

Description

technical field [0001] The invention relates to the application field of image processing technology, in particular to a detection method, medium and equipment for the contour and line width and distance defects of a flexible packaging substrate. Background technique [0002] Flexible packaging substrate is a high-precision foldable circuit board, which is widely used in high-density integrated circuit packaging. Flexible packaging substrates are mainly divided into copper wire area and non-copper wire area (background area). It can reflect the basic situation of the substrate circuit, such as whether the size meets the standard, whether there is a line sawtooth, etc. Therefore, it is necessary to strictly test the line width and line spacing of the copper line area, so as to prevent defective products from entering the market. Due to the increasing density of flexible packaging substrates, traditional manual visual inspection is not only inefficient, but also difficult to ...

AI Technical Summary

Problems solved by technology

[0007] In the prior art, the commonly used line width detection method is as follows: first extract the center line of the target line, and then search for contour points in both directions along the normal line of each point on the center line, until the contours on both sides of the center line are traversed, the corresponding The line width is the sum of the distances traversed in both directions, but the efficiency of point-by-point traversal is low

Images