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Flexible packaging substrate contour, line width and line distance defect detection method, medium and equipment

A flexible packaging and contour detection technology, which is applied in the application field of image processing technology and can solve problems such as low efficiency of point-by-point traversal.

Pending Publication Date: 2021-05-18
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In the prior art, the commonly used line width detection method is as follows: first extract the center line of the target line, and then search for contour points in both directions along the normal line of each point on the center line, until the contours on both sides of the center line are traversed, the corresponding The line width is the sum of the distances traversed in both directions, but the efficiency of point-by-point traversal is low

Method used

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  • Flexible packaging substrate contour, line width and line distance defect detection method, medium and equipment
  • Flexible packaging substrate contour, line width and line distance defect detection method, medium and equipment
  • Flexible packaging substrate contour, line width and line distance defect detection method, medium and equipment

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Embodiment 1

[0088] This embodiment discloses a method for detecting the outline of a flexible packaging substrate, which can be executed on smart devices such as computers, such as figure 1 , the steps of the method include:

[0089] Step S1. Obtain the image O of the flexible packaging substrate to be detected, such as image 3 As shown in , it is used as the initial guide image; for the flexible packaging substrate image O, the variable-scale iterative guide filter is used for texture removal and edge smoothing, and the filtered image Q is obtained, as follows:

[0090] Step S11, firstly adjust the size of the selected flexible packaging substrate image O to N×N pixels, and determine the initial value r of the scale space parameter 0 :

[0091]

[0092] Among them, r 0 is the initial value of the scale space parameter, T is the total number of iterations, and N is the side length of the original image O;

[0093] Step S12, in linear form r=k(t-1)+r 0 Reduce the scale space param...

Embodiment 2

[0104] This embodiment discloses a method for detecting line width and distance defects of a flexible packaging substrate. For the flexible packaging substrate that needs to be detected, the contour image E is obtained through the method for detecting the contour of the flexible packaging substrate described in Embodiment 1; and then as follows figure 2 As shown in , perform the following steps:

[0105] Step S3, perform contour extraction on the contour image E to obtain a contour set U c , for the contour set U c Each contour in is fitted with a piecewise straight line to obtain the contour set U c The corresponding fitting line set U l =(U l1 ,U l2 … U li … U ln ), where U li Indicates the fitting straight line sequence corresponding to contour i, and n represents the number of contours; the details are as follows:

[0106] S31. For the starting point and the ending point of the contour, select p adjacent points respectively to perform coordinate smoothing processi...

Embodiment 3

[0137] This embodiment discloses a device for detecting the contour of a flexible packaging substrate, the steps of which include:

[0138] An image acquisition module, configured to acquire an image O of a flexible packaging substrate to be detected as an initial guide image;

[0139] The filtering module is used to perform texture removal and edge smoothing processing by using variable-scale iterative guided filtering for the image O of the flexible packaging substrate to obtain a filtered image Q;

[0140] The contour image generation module is used to process the filtered image Q by using the adaptive threshold segmentation algorithm of the Otsu method, and perform eight-neighborhood connection to obtain the contour image E.

[0141] For the specific implementation of the above-mentioned modules in this embodiment, reference may be made to the above-mentioned Embodiment 1, which will not be repeated here. It should be noted that the device provided in this embodiment is o...

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Abstract

The invention discloses a flexible packaging substrate contour, line width and line distance defect detection method, a medium and equipment, and the method comprises the steps: firstly, selecting a flexible packaging substrate image needing to be detected as an initial guide image, and carrying out texture removal and edge smoothing processing on the initial guide image through variable-scale iteration guide filtering; and processing the filtered image by adopting an adaptive threshold segmentation algorithm improved by an Otsu method to obtain a contour image. According to the method provided by the invention, the problem of inaccurate boundary extraction caused by fuzzy circuit edge of the high-texture flexible packaging substrate is solved by combining the improved guide filtering with the improved edge detection operator, so that the detail information of the image edge can be reserved, the copper surface texture can be eliminated, and the outline of the copper wire area of the substrate can be quickly and accurately extracted. By fitting the straight line and the curve and detecting the line width and the line distance between the contour curves, the detection of the notch defect of the contour curve part can be further solved, and the method has the advantage of simple and rapid fitting of the straight line and the curve part.

Description

technical field [0001] The invention relates to the application field of image processing technology, in particular to a detection method, medium and equipment for the contour and line width and distance defects of a flexible packaging substrate. Background technique [0002] Flexible packaging substrate is a high-precision foldable circuit board, which is widely used in high-density integrated circuit packaging. Flexible packaging substrates are mainly divided into copper wire area and non-copper wire area (background area). It can reflect the basic situation of the substrate circuit, such as whether the size meets the standard, whether there is a line sawtooth, etc. Therefore, it is necessary to strictly test the line width and line spacing of the copper line area, so as to prevent defective products from entering the market. Due to the increasing density of flexible packaging substrates, traditional manual visual inspection is not only inefficient, but also difficult to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/13G06T7/11G06T7/136G06T7/194G06T7/181G06T5/00G06T5/20G06T7/00
CPCG06T7/13G06T7/11G06T7/194G06T7/136G06T7/181G06T5/20G06T7/0006G06T2207/20004G06T2207/20192G06T2207/30148G06T5/70
Inventor 罗家祥李巍鲁思奇
Owner SOUTH CHINA UNIV OF TECH
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