Pressing and fixing machine processing equipment for storage chip

A technology for processing equipment and storage chips, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as long-term modification time affecting production efficiency, damage to storage chips, and reduction of storage chip quality.

Active Publication Date: 2021-05-18
深圳市铨天科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a compacting machine processing equipment for storing chips, to solve the above-mentioned problem in the background art that due to the use of different substrates with different frame sizes, the replacement product is the fixture of the die-bonding mold, wh

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  • Pressing and fixing machine processing equipment for storage chip
  • Pressing and fixing machine processing equipment for storage chip
  • Pressing and fixing machine processing equipment for storage chip

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-8 , the present invention provides a technical solution: a compacting machine processing equipment for storing chips, comprising a compacting machine body 1, a servo motor 301 and a vacuum pump 605, a fixing plate 101 is fixedly installed on the compacting machine body 1, and A sleeve rod 102 is inserted on the fixed plate 101, a fixed rod 103 is inserted on the sleeve rod 102, and the bottom end of the fixed rod 103 is fixedly connected t...

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Abstract

The invention discloses a pressing and fixing machine processing equipment for storage chip. The pressing and fixing machine machining equipment comprises a pressing and fixing machine body, a servo motor and a vacuum pump, a fixing plate is fixedly installed on the pressing and fixing machine body, a sleeve rod is inserted into the fixing plate, a fixing rod is inserted into the sleeve rod, the bottom end of the fixing rod is fixedly connected to a jig plate, a sliding block is arranged in the jig plate, a connecting rod is fixedly connected to the sliding block, the bottom end of the connecting rod is fixedly connected to a fixing seat, the fixing seat is fixedly connected to the pressing plate, an equipment box is fixedly installed on the fixing plate, a servo motor is fixedly installed in the equipment box, and the servo motor is sleeved with a transmission belt. When the jig plate needs to move downwards, the equipment box starts to operate, the transmission belt rotates through operation of the equipment box, the fluted disc rotates through rotation of the transmission belt, the fluted disc rotates to drive the push rod to move downwards, and therefore the jig plate can conduct pressing work conveniently.

Description

technical field [0001] The invention relates to the technical field of chip processing, in particular to a compression machining equipment for storing chips. Background technique [0002] With the improvement of people's living standards and the rapid development of science and technology, people's living standards are gradually improving. We often use electronic equipment in our current life. There are many electrical components in electronic equipment. The most important of these is the storage chip, which is widely used because of its small size but a large amount of stored content; [0003] 1. The existing storage chips all need to be processed by wafer grinding, cutting, die bonding, wire bonding, compression molding, cutting, etc. Now when doing different packaging forms in the production process, such as Micro-SD , BGA, UDP, SD, due to the use of different substrates with different frame sizes, when changing products, the fixtures and fixtures of the die-bonding mold...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67092H01L21/67121H01L21/67126
Inventor 汪浩
Owner 深圳市铨天科技有限公司
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