Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Ultrathin ultraviolet LED chip capable of emitting light efficiently

An LED chip, high-efficiency technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of general heat dissipation performance, poor light output efficiency, limited use effect, etc., to improve internal heat dissipation effect, prolong service life, and enhance work. efficacy effect

Active Publication Date: 2021-05-25
深圳市众芯诺科技有限公司
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an ultra-thin ultraviolet LED chip with high-efficiency light output to solve the problem of poor light output performance in the above-mentioned background technology, its internal heat dissipation performance is relatively general, and the overall structure limits the overall use effect. The problem of realizing ultra-thin structure without destroying the basic use function

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrathin ultraviolet LED chip capable of emitting light efficiently
  • Ultrathin ultraviolet LED chip capable of emitting light efficiently
  • Ultrathin ultraviolet LED chip capable of emitting light efficiently

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] see Figure 1-6 , the present invention provides a technical solution: a high-efficiency light-emitting ultra-thin ultraviolet LED chip, including a loading base plate 1, a loading cavity 2, a docking hole 3, a primary square groove 4, a microcircuit substrate 5, a connecting electrode 6, two Level square slot 7, carrying main board 8, adapter slot 9, main board 10, heat sink 11, functional laminate 12, docking pin 13, docking electrode 14, anti-interfe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an ultra-thin ultraviolet LED chip capable of emitting light efficiently. The ultra-thin ultraviolet LED chip comprises a loading bottom plate, a loading cavity is pre-formed in the loading bottom plate, a butt joint hole is pre-formed in the upper end of the outer side of the loading bottom plate, and a first-stage square groove is pre-formed in the middle of the loading cavity. And a micro circuit substrate is fixedly installed at the lower end of the interior of the loading cavity, a secondary adaptive contact layer is fixedly installed at the other side of the upper end of the exterior of the auxiliary light-emitting layer, a transparent conductive layer is fixedly connected to the upper end of the exterior of the secondary adaptive contact layer, and a negative electrode metal connecting piece is fixedly installed at the upper end of the exterior of the transparent conductive layer. According to the ultra-thin ultraviolet LED chip capable of emitting light efficiently, due to the arrangement of the cooling fins and the auxiliary cooling grooves, the internal cooling effect of the whole chip in normal use and work is improved to the maximum extent, and the service life of the whole chip can be prolonged. The ultraviolet light-emitting layer plate is additionally arranged, the overall working efficiency is effectively enhanced on the basis that the overall LED light-emitting effect is achieved.

Description

technical field [0001] The invention relates to the technical field of LED chips, in particular to an ultra-thin ultraviolet LED chip with high-efficiency light emission. Background technique [0002] The LED chip is a solid-state semiconductor device. The heart of the LED is a semiconductor wafer. One end of the wafer is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply, so that the entire wafer is encapsulated by epoxy resin. LED Chips are the core components in modern LED products. [0003] The overall structure of the existing LED chip in the existing market has a large thickness and does not have good heat dissipation performance. In the long-term use work, it is easy to cause internal overheating due to the limitation of its own internal structure and cause internal components to fail. Damage or failure shortens its own service life, and the overall light output performance is relatively averag...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64
CPCH01L33/48H01L33/642
Inventor 代克金时婷婷谌倩雯郭翠霞
Owner 深圳市众芯诺科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products