High-frequency pulse laser pressure stress implantation rapid forming system and method

A high-frequency pulse, compressive stress technology, applied in the field of high-frequency pulse laser implanted compressive stress rapid prototyping system

Pending Publication Date: 2021-05-28
北京机科国创轻量化科学研究院有限公司烟台分公司
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Problems solved by technology

[0007] Aiming at the existing technical problems, the present invention provides a system and method for rapid prototyping of compressive stress implanted by high-frequency pulse laser

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  • High-frequency pulse laser pressure stress implantation rapid forming system and method

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Embodiment Construction

[0039] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0040] Such as figure 1 As shown, a high-frequency pulse laser implanted compressive stress rapid prototyping system includes: a laser control system 11, a high-frequency pulse laser generator 1, a powder feeder 2, a motion system 5, and a coaxial powder feeding laser cladding head 6 and an inert gas source 10 .

[0041] The laser control system 11 includes a PLC control system and a human-machine interface, which can control and display process parameters such as laser output power on the man-machine interface; and can store and automatically run process parameters.

[0042] According to the drawing requirements of the preformed metal parts, the CAD model of the preformed part is established, and the established C...

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Abstract

The invention relates to a high-frequency pulse laser pressure stress implantation rapid forming system and method. The forming system comprises a laser control system, a high-frequency pulse laser generator, a powder feeder, a motion system, a coaxial powder feeding laser cladding head and an inert gas source, wherein the laser control system is used for obtaining the data of a preformed part and converting the data into a control instruction for controlling the motion mode and the motion path of the motion system; the high-frequency pulse laser generator is connected with the motion system and is used for emitting laser pulses with specified frequency and implanting pressure stress into a cladding point by utilizing the laser pulses; the powder feeder is connected with the motion system and used for providing cladding powder, and an electromagnetic switch is arranged on the powder feeder; the motion system is connected with the coaxial powder feeding laser cladding head and used for controlling the motion state of the coaxial powder feeding laser cladding head; the coaxial powder feeding laser cladding head is used for coaxially conveying the laser pulses and the cladding powder to a metal substrate; and the inert gas source is connected with the powder feeder and the motion system and used for providing inert gas to prevent the cladding powder from being oxidized. simultaneous pressure stress implantation rapid forming is realized in the laser cladding process.

Description

technical field [0001] The invention relates to the technical field of rapid prototyping, in particular to a rapid prototyping system and method for implanting compressive stress with a high-frequency pulse laser. Background technique [0002] Laser shot peening technology is an effective solution to metal fatigue. Similar to conventional shot peening, it also enhances the fatigue resistance of metal parts by introducing residual compressive stress on the metal surface. The difference is that laser peening uses high-energy high-frequency pulsed laser to induce shock waves on the surface of parts. The shock waves act on the metal surface to produce plastic deformation and implant compressive stress at the same time. The residual compressive stress enhances the resistance of the part material to surface-related damage. ability. [0003] Laser peening technology first occurred in Bell Laboratories in the United States in the early 1970s. In 1972, Fairand BP et al. used high-po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105B22F12/45B22F12/20B22F10/28C21D10/00B33Y30/00B33Y10/00B23K26/352B23K26/70
CPCB22F3/105B33Y10/00B33Y30/00B23K26/702B23K26/3576C21D10/00Y02P10/25
Inventor 孙福臻刘阳姜波李岩
Owner 北京机科国创轻量化科学研究院有限公司烟台分公司
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