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Integrated chip, thick film pressure sensor and manufacturing method thereof

A pressure sensor, integrated chip technology, applied in instruments, measuring force, scientific instruments, etc., can solve the problems of complex packaging process and poor environmental adaptability

Pending Publication Date: 2021-05-28
WUHAN FINEMEMS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the embodiment of the present invention is to provide an integrated chip, a thick film pressure sensor and its manufacturing method, aiming to solve the problem of complicated packaging process caused by separately setting the temperature chip and the pressure chip in the thick film pressure sensor in the prior art, and the environmental impact The problem of poor adaptability

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  • Integrated chip, thick film pressure sensor and manufacturing method thereof
  • Integrated chip, thick film pressure sensor and manufacturing method thereof
  • Integrated chip, thick film pressure sensor and manufacturing method thereof

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Embodiment Construction

[0064] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0065]It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0066] In addition, if there are descriptions involving "first", "second" and s...

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Abstract

The invention provides an integrated chip, a thick film pressure sensor and a manufacturing method of the thick film pressure sensor. The integrated chip for the thick film pressure sensor comprises an elastic metal diaphragm and a conductive circuit, wherein the elastic metal diaphragm is provided with a deformation area for sensing pressure and a connection area connected with the deformation area, the conductive circuit comprises a plurality of piezoresistors and a thermistor, the piezoresistors are arranged on the upper surface of the elastic metal diaphragm and arranged in the deformation area, and the thermistor is arranged on the upper surface of the elastic metal diaphragm and arranged in the connection area.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of thick-film pressure sensors, and in particular to an integrated chip, a thick-film pressure sensor and a manufacturing method thereof. Background technique [0002] A thick film pressure sensor is a device or device that can sense pressure signals and convert the pressure signals into usable output electrical signals according to certain rules. In the prior art, if a thick-film pressure sensor is required to be able to sense temperature at the same time, a temperature chip is separately connected to the thick-film pressure sensor, and the temperature chip and the pressure chip are separately provided, which increases the complexity of the packaging process and affects the environment. poor adaptability. Contents of the invention [0003] The purpose of the embodiment of the present invention is to provide an integrated chip, a thick film pressure sensor and its manufacturing metho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/22G01K7/22
CPCG01L1/225G01L1/2287G01K7/22
Inventor 王小平曹万李凡亮吴登峰李兵
Owner WUHAN FINEMEMS
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