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Cooling liquid for diamond wire cutting circulation system and preparation method and use method thereof

A diamond wire and circulation system technology, applied in the petroleum industry, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of large fluctuations in the yield rate of cutting workpieces, difficult concentration indicators, and difficult control of recycled water quality indicators. Achieve the effect of easy index detection and quality control

Active Publication Date: 2021-06-01
武汉宜田科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the embodiments of the present invention is to solve the problems such as the difficult control of the quality index of the recycled water in the recycled water circulation system of the existing diamond wire cutting coolant, the difficult detection of the concentration index, and the large fluctuation of the product yield of the cutting workpiece.

Method used

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  • Cooling liquid for diamond wire cutting circulation system and preparation method and use method thereof
  • Cooling liquid for diamond wire cutting circulation system and preparation method and use method thereof
  • Cooling liquid for diamond wire cutting circulation system and preparation method and use method thereof

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Effect test

Embodiment 1

[0037] The parts by weight of the formula are as follows (the total parts by weight is 100):

[0038] Modified polyether: 18

[0039] water: balance

[0040] The thioether modifier of the above-mentioned modified polyether is 1,3-dimercaptopropane, and the polyether is propylene polyoxyethylene polyoxypropylene ether (m=5, n=5).

Embodiment 2

[0042] The parts by weight of the formula are as follows (the total parts by weight is 100):

[0043] Modified polyether: 15

[0044] water: balance

[0045] The silicon modifier of the above-mentioned modified polyether is 1,3-dimercaptopropane, and the polyether is methyl pentyl polyoxyethylene polyoxypropylene ether (m=6, n=4).

Embodiment 3

[0047] The parts by weight of the formula are as follows (the total parts by weight is 100):

[0048] Modified polyether: 15.5

[0049] water: balance

[0050] The silicon modifier of the above-mentioned modified polyether is 1,4-dimercaptopropane, and the polyether is vinyl butanediol ether polyoxyethylene ether polyoxypropylene ether (m=8, n=6).

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Abstract

The invention relates to a cooling liquid for a diamond wire cutting circulation system and a preparation method and a use method thereof. The cutting liquid is mainly prepared by the following components: 10-30 part by weight of modified polyether; and the balance of water, wherein total weight part is 100. By implementing the embodiment of the invention, the cooling liquid has the following beneficial effects that the cooling liquid has a low-foam self-defoaming function, and a defoaming agent component does not need to be additionally added; a thioether group is introduced into a polyether structure so that the modified polyether has relatively low dynamic surface tension and extremely strong wetting ability and adsorption and dispersion performance, and the process is a better spraying circulation cutting process, the product structure system is stable, and the thioether structure has relatively strong antibacterial performance, and is more suitable for a cooling liquid large circulation system; and the problem of influence on cutting production due to bacteria growth of water in the existing circulation system is well controlled.

Description

technical field [0001] The invention relates to a wire cutting cooling liquid, in particular to a cooling liquid for a diamond wire cutting circulation system. Background technique [0002] The production process of silicon wafers for solar photovoltaic cells has gone through the following stages in turn: inner circle cutting process stage, mortar straight steel wire multi-wire cutting process stage, mortar structure wire multi-wire cutting process stage, diamond wire multi-wire cutting process stage , since 2010, silicon wafer production enterprises have conducted experimental research on diamond wire multi-wire cutting. (wet black silicon texturing process), the diamond wire cutting process has developed explosively, replacing the mortar multi-wire cutting process. The comprehensive promotion of the diamond wire multi-wire cutting process is due to its specific advantages: ①The cutting process time is short, which is 3~7 times shorter than that of the sand wire cutting pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/02C10N40/22
CPCC10M173/02C10M2229/047Y02P70/50
Inventor 杨文勇洪育林张震
Owner 武汉宜田科技发展有限公司
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