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Driving board heat dissipation structure and air conditioner

A technology of heat dissipation structure and driving board, which is applied in air-conditioning systems, household heating, heating methods, etc., can solve the problem of condensation affecting the driving board, and achieve the effect of avoiding short circuit

Active Publication Date: 2021-06-01
QINGDAO HISENSE HITACHI AIR CONDITIONING SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the above-mentioned problem in the prior art that the driving board adopts the refrigerant heat dissipation technology to generate condensation and affect the driving board, an embodiment of the present invention provides a driving board heat dissipation structure and an air conditioner, which can condense the refrigerant radiator by setting a deflector plate. The dew is exported to the electrical box to prevent the short circuit of the drive board circuit caused by condensation when the temperature of the radiator is too low

Method used

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  • Driving board heat dissipation structure and air conditioner
  • Driving board heat dissipation structure and air conditioner
  • Driving board heat dissipation structure and air conditioner

Examples

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Embodiment 1

[0045] Such as Figure 1-Figure 9 As shown, the heat dissipation structure of the driving board of this embodiment is arranged in the electrical box 1 of the air conditioner. The heat dissipation structure of the driving board includes a driving board 100 and a heat dissipation system for dissipating heat from the driving board 100 . Such as figure 2 As shown, the cooling system mainly includes a driver board 100 , a module radiator 200 and a refrigerant radiator 300 . The driving board 100 includes a power module 110 fixed on the driving board 100 . The module radiator 200 is located on one side of the driver board 100 , and the inner surface of the module radiator 200 (the side close to the driver board 100 ) is in close contact with the power module 110 . The refrigerant radiator 300 includes a heat dissipation plate 310 and a refrigerant heat dissipation pipe 320 fixed on the heat dissipation plate 310 . The cooling plate 310 is in close contact with the outer surface...

Embodiment 2

[0069] In this example, see Figure 10 and Figure 11 The heat dissipation structure of the driving board is a set of driving board 100 and heat dissipation system (module radiator 200, refrigerant radiator 300), wherein the structure of the deflector 400 is the same as that of the lower part in Embodiment 1, because the structure of the driving board and the refrigerant radiator There is only one cooling plate, so the deflector does not need to be provided with oblique deflector ribs.

[0070] The present invention also includes an air conditioner, wherein an electrical box is arranged in the air conditioner, and the heat dissipation structure of the driving board is arranged in the electrical box.

[0071] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.

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Abstract

The invention relates to the technical field of household appliances, and aims to provide a driving board heat dissipation structure and an air conditioner. The driving board heat dissipation structure comprises a driving board, a module heat dissipation device, a refrigerant heat dissipation device and a flow guide plate; the driving board is provided with a power module; the inner side surface of the module heat dissipation device is in close contact with the power module; the refrigerant heat dissipation device comprises a heat dissipation plate and a refrigerant heat dissipation pipe, the heat dissipation plate is in close contact with the outer side face of the module heat dissipation device; and the flow guide plate is arranged between the module heat dissipation device and the refrigerant heat dissipation device, a containing opening is formed in the flow guide plate, the heat dissipation plate is arranged in the containing opening in an embedded mode, and flow guide ribs are arranged on the side face, close to the refrigerant heat dissipation device, of the flow guide plate and used for guiding condensate water generated on the refrigerant heat dissipation device downwards. According to the driving plate heat dissipation structure, the condensate water on the surface of the refrigerant heat dissipation device can be guided downwards through the flow guide plate, finally, the condensate water flows to the exterior of an electrical box, and therefore the condensate water is prevented from flowing along the surfaces of the module heat dissipation device and the refrigerant heat dissipation device or permeating to the surface of the driving plate, and potential safety hazards such as short circuit are avoided.

Description

technical field [0001] The invention relates to the technical field of household appliances, in particular to a heat dissipation structure of a driving board and an air conditioner. Background technique [0002] The outdoor unit of the air conditioner realizes the frequency conversion power output to the compressor and the fan through the drive circuit to ensure the normal operation of the air conditioner system. The power module on the driver board generates a lot of heat due to high current density and high computing performance. Effective cooling of the power module is required to ensure its normal operation. [0003] Due to the advantages of high heat dissipation efficiency, stable performance, and small footprint, refrigerant heat dissipation technology is being more and more used in the field of air conditioning power module heat dissipation. But because under certain extreme working conditions (low frequency operation, high humidity), the surface of the radiator wil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24F1/16F24F1/24F24F1/36F24F13/22F24F13/30
CPCF24F1/16F24F1/24F24F1/36F24F13/222F24F13/30
Inventor 崔银虎高越郇岩强蒋茂灿
Owner QINGDAO HISENSE HITACHI AIR CONDITIONING SYST
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