Driving board heat dissipation structure and air conditioner
A technology of heat dissipation structure and driving board, which is applied in air-conditioning systems, household heating, heating methods, etc., can solve the problem of condensation affecting the driving board, and achieve the effect of avoiding short circuit
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Embodiment 1
[0045] Such as Figure 1-Figure 9 As shown, the heat dissipation structure of the driving board of this embodiment is arranged in the electrical box 1 of the air conditioner. The heat dissipation structure of the driving board includes a driving board 100 and a heat dissipation system for dissipating heat from the driving board 100 . Such as figure 2 As shown, the cooling system mainly includes a driver board 100 , a module radiator 200 and a refrigerant radiator 300 . The driving board 100 includes a power module 110 fixed on the driving board 100 . The module radiator 200 is located on one side of the driver board 100 , and the inner surface of the module radiator 200 (the side close to the driver board 100 ) is in close contact with the power module 110 . The refrigerant radiator 300 includes a heat dissipation plate 310 and a refrigerant heat dissipation pipe 320 fixed on the heat dissipation plate 310 . The cooling plate 310 is in close contact with the outer surface...
Embodiment 2
[0069] In this example, see Figure 10 and Figure 11 The heat dissipation structure of the driving board is a set of driving board 100 and heat dissipation system (module radiator 200, refrigerant radiator 300), wherein the structure of the deflector 400 is the same as that of the lower part in Embodiment 1, because the structure of the driving board and the refrigerant radiator There is only one cooling plate, so the deflector does not need to be provided with oblique deflector ribs.
[0070] The present invention also includes an air conditioner, wherein an electrical box is arranged in the air conditioner, and the heat dissipation structure of the driving board is arranged in the electrical box.
[0071] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.
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