Test platform of flash memory chip

Abstract

The invention relates to a test platform of a flash memory chip, and the test platform is characterized in that: the test platform sequentially comprises a test working face (47), a vacuumizing assembly (46), a horizontal rotating sliding block (45), a horizontal rotating outer frame (44), a front-back moving sliding block (43), a left-right moving sliding block (42), a test platform base (41) and a test machine base (31) from top to bottom. According to the test platform, electric equipment is adopted, physical power consumption of hand-cranking lifting of an operator is solved, the problems of high speed, low speed, yield fluctuation and efficiency loss of manual operation are also solved, and the equipment utilization rate is greatly improved.

Description

technical field [0001] The invention relates to a testing platform for a flash memory chip. Background technique [0002] A flash memory chip is a mobile data storage device that can store files and data in any format. It is small, light, and easy to carry. It can be said to be a small personal mobile database. [0003] The detection of the flash memory chip needs to be carried out together with the computer, and then through software. The flash memory chip can be detected by two methods: bad block detection and speed detection. If the file is damaged during bad block detection, it means that there is a problem with the flash memory chip. The speed of the flash memory chip can be tested by speed detection, so as to judge the type and quality of the flash memory chip. [0004] In the prior art, after the operator of the test platform has done the action of retrieving and changing the material, he then operates the rocker. It is difficult to effectively improve. Due to fac...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, after the operator of the test platform has done the action of retrieving and changing the material, he then operates the rocker. difficult to effectively improve

Due to factors such as friction of equipment components and wear after multiple collisions of components that limit the lift, it is impossible to ensure that the contact between the probe and the wafer is consistent, resulting in the need for repeated debugging during mass testing. Therefore, frequent repeated debugging is required, and the pressure is high. The needle marks on the PAD are too large, which affects the subsequent packaging pass rate, and the pressure is small, and good contact cannot be maintained.

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