Pin jack forming method for multi-layer PCB
A PCB board and pin technology, which is applied in the field of opening pin jacks on multi-layer PCB boards, can solve problems such as short circuits and increasing the risk of short circuits.
Pending Publication Date: 2021-06-01
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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Problems solved by technology
The traces of other stacks run on the vias, which will cause short circuits, so the via design will increase the risk of short circuits
Method used
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[0026] The core of the present invention is to provide a method for opening pin jacks on a multi-layer PCB board, which adopts the setting form of blind holes, reduces the depth of the holes, and reduces the influence on wiring and the antenna effect.
[0027] In order to enable those skilled in the art to better understand the technical solution of the present invention, the method for opening pin sockets on a multilayer PCB board of the present invention will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0028] figure 1 Provide the flow chart of a kind of multilayer PCB board pin jack opening method for the present invention; figure 2 It is a structural schematic diagram of a multi-layer PCB board. It should be noted that the present invention is aimed at a PCB board with a large number of layers, and the depth of the blind hole is at least greater than three layers, because the traditional way of using las...
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The invention discloses a pin jack forming method for a multi-layer PCB. The method comprises the following steps of: laminating an inner-layer multi-layer PCB to form a middle-layer board group, drilling a middle-layer through hole in the middle-layer board group after the middle-layer board group is laminated and molded, and enabling the middle-layer through hole to penetrate through the whole middle-layer board group; pressing PCBs on the two sides of the middle-layer board group respectively to form two outer-layer board groups respectively; forming an outer-layer through hole in the outer-layer board group on one side in a penetrating manner, and aligning the outer-layer through hole and the middle-layer through hole to form a blind hole, wherein the depth of the blind hole is greater than the length of a pin to be inserted; and sandwiching the middle-layer board group between the outer-layer board groups on the two sides to form a complete PCB group, wherein the middle-layer through hole is equivalent to a buried hole in the whole PCB group, the outer-layer through holes and the middle-layer through hole are independently arranged and finally jointly combined to form the blind hole for inserting the pin. By adopting the above structure, the length of a pin jack is reduced, and antenna effect is reduced; and due to the fact that some PCB layers without holes exist, wiring of the PCB board layers is not affected by the blind hole, and a space utilization rate is improved.
Description
technical field [0001] The invention relates to the technical field of semiconductor manufacturing, and further relates to a method for opening pin sockets of a multilayer PCB board. Background technique [0002] With the rapid development of electronic products, there are currently two obvious trends in electronic products, one is light and thin, the other is high speed and high frequency, and the corresponding PCB (Printed Circuit Board, printed circuit board) development is also towards high density, High integration, encapsulation, miniaturization and multi-layer development. The wiring length of the high-layer board is short, the circuit impedance is low, it can work at high frequency and high speed, the performance is stable, and it can undertake more complex functions. It is mostly used in high-layer board communication equipment, high-end servers, medical electronics, aviation, industrial control, military and other fields. [0003] As the interface between the PCB ...
Claims
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IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/4611H05K3/0026
Inventor 汪红梅
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD