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Wafer back defect detection method, storage medium and computer equipment

A detection method and crystal back defect technology, which is applied to computer parts, calculation, image data processing, etc., can solve the problems of defect location observation and low recognition rate, and achieve the effect of improving accuracy and avoiding yield loss

Pending Publication Date: 2021-06-04
SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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Problems solved by technology

[0004] However, it is far from enough to scan the defects. The crystal back scanning is different from the crystal plane defect scanning. Document CN111754480A, while multiple defects can appear on the scanning pattern, see figure 1
Even adopted as the method in CN111754480A, its recognition rate is still lower

Method used

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  • Wafer back defect detection method, storage medium and computer equipment
  • Wafer back defect detection method, storage medium and computer equipment
  • Wafer back defect detection method, storage medium and computer equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0027] Such as figure 2 The crystal back defect detection method provided by the embodiment includes:

[0028] S1: Obtain the graphics on the back of the crystal;

[0029] S2: performing filtering and differential processing on the crystal back pattern;

[0030] S3: Distinguish whether the crystal back pattern is a baseline image or a highlighted image;

[0031] S4: Identify the defects of the crystal back through the characteristic difference of the image, and output an alarm message.

[0032] The pattern recognition of the crystal back in this embodiment mainly uses the difference between the feature codes of the baseline image and the highlighted image to perform filtering and differential processing on the image with poor crystal back, highlight the detection features, reduce the influence of the background, and automatically generate rules according to the program differentiate afterwards.

[0033] In order to illustrate the technical effect of the present embodiment...

Embodiment 2

[0042] On the basis of embodiment 1, change the specific distinguishing method in step S3 as follows:

[0043] Using single-chip multiple range comparison detection method for testing, different basic databases and test data Test tests are carried out in three times, see Figure 5 .

[0044] Three times, 6 images were randomly selected from each batch of crystal back graphics as the test data test, and the rest of the images were used as the basic database database. Each crystal back pattern is detected 3 times, and the detection rules for 3 times are set differently. The crystal back graphics that are judged as highlight images more than twice out of 3 times are finally determined as highlight images.

[0045] It can be seen from the test conclusion that compared with embodiment 1, embodiment 2 can effectively improve the detection rate and reduce the over-detection rate.

Embodiment 3

[0047] On the basis of embodiment 1, change the specific distinguishing method in step S3 as follows:

[0048] Use the rollback detection method to test, compare and calculate the test data with the latest rollback data, and judge whether it is a recent continuous occurrence. The specific methods are as follows:

[0049] The first (Approach1) is based on the highlight image highlight

[0050] Initially set the detection rules to ensure that the detected highlight image highlight must be correct, and the pass rate is 0;

[0051] For single slice detection, if the slice is judged to be a highlight image, trace back the first 50 slices that are judged to be the graphics of the baseline image baseline, compare each slice with the highlight image of the slice, and make a second judgment on whether the highlight image exists missed detection.

[0052] The second (Approach2) is based on the baseline image baseline

[0053] Initially set the detection rules to ensure that the detec...

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Abstract

The invention discloses a wafer back defect detection method. The method comprises the following steps: S1, obtaining a wafer back pattern; S2, carrying out filtering and differential processing on the wafer back pattern; S3, whether the wafer back pattern is a baseline image or a highlight image is distinguished; S4, identifying the defect of the wafer back through the feature difference of the image, and outputting alarm information. According to the method, the accuracy of distinguishing the pattern types of the wafer back can be improved, various defect morphologies of the wafer back can be effectively recognized, distinguishing and automatic judgment of the defects of the wafer back are effectively achieved, and yield loss caused by wafer back abnormity is avoided.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, and more specifically, to a crystal back defect detection method, storage medium and computer equipment. Background technique [0002] As the semiconductor chip manufacturing process becomes more and more sophisticated, the impact of crystal surface defects caused by the influence of the crystal back is also increasing. However, the scanning detection method for crystal back defects still requires human judgment, and the subjective influence is relatively large. to the occurrence of abnormalities in the online process. [0003] The existing mainstream crystal back detection methods are mainly divided into two types: 1. Crystal back visual inspection 2. Crystal back scanning; crystal back visual inspection is mainly affected by human factors, and the judgment is quite different, while crystal back scanning can effectively detect crystal back abnormalities . [0004] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T5/00G06K9/62
CPCG06T7/001G06T2207/30148G06F18/24G06T5/70
Inventor 王泽逸庄均珺王恺陈旭
Owner SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
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