Copper salt alkalescent electroplating solution for PCB hole metallization and application of copper salt alkalescent electroplating solution

Abstract

The invention discloses a copper salt alkalescent electroplating solution for PCB hole metallization and application of the copper salt alkalescent electroplating solution. The pH is 8-10, the copper salt alkalescent electroplating solution is composed of copper salt, a main coordination agent, an auxiliary coordination agent, a pH buffer agent, a uniform plating agent and an induction activator, the mass concentration of the copper salt is 5-20 g / L, and the uniform plating agent is composed of a selenium compound and a salt compound. The induction activator is composed of a cuprous reduction accelerator and a polyalcohol compound. The copper salt alkalescent electroplating solution is stable, low in total concentration of the solution and high in dispersing capacity; and the current efficiency is high, under the specified electroplating condition, obtained copper layer particles are fine and compact, the dispersion capacity value (TP) is high, and electroplating uniform thickening of PCB through holes can be achieved.

Description

technical field [0001] The invention belongs to the technical field of electronic electroplating, and in particular relates to a copper salt weakly alkaline electroplating solution for PCB hole metallization and an application thereof. Background technique [0002] The electroplating copper process is widely used in the field of electronic electroplating, such as PCB hole metallization, PCB wiring, etc. [0003] PCB is an indispensable basic component of all electronic products, known as the "mother of electronic products". With the development of electronic products towards miniaturization, light weight, intelligence and multi-function, PCB manufacturing is also required to develop towards high density, high reliability and refinement. In order to realize the rapid development of PCB, hole metallization is very important. Copper has good ductility, excellent thermal conductivity (377 / (m·K)) and high electrical conductivity (0.0172Ω·m), and is one of the ideal hole metalli...

AI Technical Summary

Problems solved by technology

The dispersing ability of the plating solution in the acidic sulfate copper plating process is highly dependent on additives, and the plating solution contains a variety of additives. It is difficult to control the synergistic effect of the mixture of various additives in the PCB acidic copper plating solution

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