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Surface cleaning and gluing device for wafer processing

A surface cleaning and gluing device technology, which is applied in spraying devices, spray booths, etc., can solve the problems of affecting production efficiency and lowering the efficiency of drying wafers, and achieve the effect of improving production efficiency and drying efficiency

Active Publication Date: 2021-06-18
JIANGSU ASIA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are the following disadvantages in the existing cleaning and gluing equipment: 1. Cleaning and gluing are in the same sealed chamber. Since the wafer needs to be dried once after cleaning and gluing, the sealing chamber must be sealed after cleaning and gluing. The internal humidity is high, so the efficiency of drying wafers becomes low, which affects production efficiency

Method used

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  • Surface cleaning and gluing device for wafer processing
  • Surface cleaning and gluing device for wafer processing
  • Surface cleaning and gluing device for wafer processing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Such as Figure 1-7As shown, a surface cleaning and gluing device for wafer processing includes a sealing device 1. The sealing device 1 is mainly composed of a supporting leg 101, a box body 102, and a sealing cover 103. The bottom of the box body 102 is connected with a supporting leg by bolts 101, the top of the box body 102 is covered with a sealing cover 103, and the top of the sealing cover 103 is provided with a cleaning equipment body 105, a drying equipment body A106, a gluing equipment body 107, a drying equipment body B108, and a rotating support mechanism 2 and a sealing plate 3 , the split mechanism 4, the rotary support mechanism 2 includes an adjustment motor 201, a turret 202, a sucker discharge table 203, a transmission pipe 204, a first chain 205, a second chain 206, a drive motor 207, a connecting rod 208, and the adjustment motor 201 passes through Bolts are connected to the bottom center of the box body 102, the output end of the adjustment motor 20...

Embodiment 2

[0037] Such as Figure 8 As shown, the difference between Embodiment 2 and Embodiment 1 is that the collection mechanism 5 includes an arc-shaped collection box 51, which is connected to the inner bottom of the box body 102 by screws, and the arc-shaped collection box 51 is provided with four , and four arc-shaped collection boxes 51 form a ring, the annular outer wall is located outside the sealing plate 3, and the top is higher than the top of the sealing plate 3, the annular inner wall is located inside the edge of the sealing plate 3, and the top is lower than the sealing plate 3 , so that the excess cleaning fluid and spraying fluid can be collected separately.

[0038] In the above structure, when in use, the wafer is first placed on the first suction cup discharge table 203, and then the negative pressure pump connected to the bottom of the suction cup discharge table 203 is started, so that the wafer is fixed on the suction cup discharge table 203, and then Start the ...

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Abstract

The invention discloses a surface cleaning and gluing device for wafer processing. The surface cleaning and gluing device comprises sealing equipment, wherein the sealing equipment mainly comprises supporting legs, a box body and a sealing cover; the bottom of the box body is connected with the supporting legs through bolts; the top of the box body is covered with the sealing cover; and the surface cleaning and gluing device further comprises a rotary supporting mechanism, a sealing plate and a dividing mechanism. According to the surface cleaning and gluing device disclosed by the invention, a connecting frame can be driven to descend through an air cylinder, and the connecting frame drives the sealing cover to descend, so that the sealing cover is buckled on the sealing plate, and cleaning, drying and spraying of wafers are respectively carried out in different and smaller sealed spaces; when the wafers are dried, the humidity of the inner space of a drying chamber is smaller, so that the drying efficiency is favorably improved; and a transmission pipe can also be driven to rotate through a driving motor under the action of a second chain, and four sucking disc discharging tables are driven to rotate through the transmission pipe under the action of a first chain, so that the work of cleaning, drying, spraying and drying the wafers at different stations is realized, and the production efficiency is further improved.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a surface cleaning and gluing device for wafer processing. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; it can be processed into various circuit element structures on the silicon wafer, and becomes an integrated circuit with specific electrical functions. circuit products. The raw material of the wafer is silicon, and the surface of the earth's crust has an inexhaustible amount of silicon dioxide. Silica ore is refined by electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon, with a purity as high as 99.999999999%. [0003] In the semiconductor manufacturing process, in order to prevent the debris and powder from laser grooving from contaminating the wafer, the surface of the wa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05B16/20B05B16/40B05B13/02
CPCB05B13/0228B05B16/20B05B16/40
Inventor 钱诚李刚童建
Owner JIANGSU ASIA ELECTRONICS TECH CO LTD