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A dual-beam maskless lithography system

A maskless lithography and double beam technology, applied in the field of maskless lithography, can solve problems such as increasing the cost of integrated circuits, and achieve the effect of improving lithography resolution

Active Publication Date: 2022-04-12
ZHONGSHAN AISCENT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the resolution of lithography, short-wavelength exposure light sources or high numerical aperture lenses are usually required, which greatly increases the cost of integrated circuits

Method used

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  • A dual-beam maskless lithography system
  • A dual-beam maskless lithography system
  • A dual-beam maskless lithography system

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Embodiment Construction

[0028] In the drawings, the same or similar reference numerals are used to denote the same or similar elements or elements having the same or similar functions. Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0029] In the description of the present invention, the terms "central", "longitudinal", "transverse", "front", "rear", "left", "right", "vertical", "horizontal", "top", " The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or element Must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the scope of the invention.

[0030] The dual-beam maskless litho...

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PUM

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Abstract

The invention discloses a double-beam maskless photolithography system. The double-beam maskless lithography system includes: first and second light sources, a beam expander and homogenization unit (2), an optical field modulation unit (3) and a beam adjustment unit (4), the first light source is used to emit excitation light; the second light source is used to emit lost light; the beam adjustment unit (4) is used to convert the patterned parallel beam array formed after the beam expander homogenization unit (2) and the light field modulation unit (3) into an imaging plane Pixel lattice, the center of the non-zero pixel point of the pixel lattice is the first beam solid circle (601), and the outer ring is the second beam hollow ring (602), wherein, the diameter of the first beam solid circle (601) is larger than the first beam solid circle (601) The inner diameter of the second beam hollow ring (602) is smaller than the outer diameter of the second beam hollow ring (602). The double-beam maskless photolithography system of the present invention can reduce the size of a single photolithography spot, thereby significantly improving the photolithography resolution.

Description

technical field [0001] The invention relates to the technical field of maskless lithography, in particular to a dual-beam maskless lithography system. Background technique [0002] Photolithography technology is the cornerstone of the development of the integrated circuit industry. With the further development of semiconductor and other fields, integrated circuits are gradually becoming lighter, thinner, and miniaturized, which puts forward higher requirements for lithography resolution. Lithography is limited by the diffraction limit of optics, and its resolution depends on the wavelength of the light source and the numerical aperture of the lens. In order to improve the resolution of lithography, a short-wavelength exposure light source or a lens with a high numerical aperture is usually required, which greatly increases the cost of the integrated circuit. How to further improve the resolution of lithography technology while ensuring processing efficiency and cost is a c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/2051G03F7/70091
Inventor 陈冠楠梅文辉
Owner ZHONGSHAN AISCENT TECH