BGA chip top heater and heating system

A bottom heater and heater technology, applied in electrical components, printed circuit manufacturing, printed circuit, etc., can solve problems such as inaccurate temperature control

Pending Publication Date: 2021-06-18
库尔特机电设备(上海)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the purpose of the embodiment of the present application is to provide a BGA chip top heater and heatin

Method used

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  • BGA chip top heater and heating system
  • BGA chip top heater and heating system
  • BGA chip top heater and heating system

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Embodiment Construction

[0031] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0032] According to the applicant's research, the chip heater commonly used in the prior art is usually divided into upper and lower parts, with a board fixture in the middle, and the temperature curve is controlled by a program. Heater power and size vary primarily by design and application. The hot air nozzle on the heater is mainly replaced according to the size of the chip to be repaired. Generally, the temperature range can be set from room temperature to about 320 degrees. The main function is to uniformly heat the device with a hot air nozzle (Nozzle) to cover the device as tightly as possible. The hot air is delivered to the body of the device being repaired through the nozzle, so that the temperature of the device will rise.

[0033] The traditional hot air BGA rework station needs to be h...

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Abstract

The invention provides a BGA chip top heater and a heating system and relates to the technical field of semiconductor manufacturing. The BGA chip top heater comprises a shell, a piece suction device, a hot air device, an infrared radiation device and a convection mechanism, wherein the piece suction device axially extends out of a bottom opening of the shell in the longitudinal direction of the shell, an air outlet of the hot air device faces the bottom opening, the infrared radiation device is arranged above the bottom opening, the convection mechanism is arranged between the hot air device and the infrared radiation device; the part sucking device sucks a to-be-heated chip, the hot air device outputs airflow, the infrared radiation device is used for heating the airflow passing through the convection mechanism to form hot air to heat the to-be-heated chip, and the infrared radiation device is further used for conducting infrared heating on the to-be-heated chip. According to the top heater, non-contact heating can be carried out without a nozzle through a special heating mode combining infrared and hot air heating sources, no hot air flows and blows away adjacent devices, and heating accuracy of the devices can be improved.

Description

technical field [0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a BGA chip top heater and heating system. Background technique [0002] In the surface mount maintenance of printed circuit boards, the chip rework of the BGA (Ball Grid Array, ball grid array package) chip rework station is a key process. The chip is heated and melted according to a specific temperature rise slope and temperature range, removed, re-mounted, and then re-mounted according to the temperature curve in normal production and re-welded with the circuit board and parts. Because the general cost of BGA or chip is relatively high, there are many factors affecting the PCBA (Printed Circuit Board Assembly) manufacturing process, so the application of this equipment will directly reduce the scrap rate in the manufacturing process. [0003] At present, the top of the heater is heated by a single hot air nozzle, and the bottom is heated by infrar...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/341H05K3/3494
Inventor 王选平
Owner 库尔特机电设备(上海)有限公司
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