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Novel rapid packaging method for COB packaging integrated circuit

A packaging method and integrated circuit technology, applied in circuits, electrical components, electrical solid devices, etc., can solve problems such as product quality failures, increased production costs, and inability to install

Inactive Publication Date: 2021-06-22
鑫金微半导体(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In this process, during the resin coating process, there is a period of delay between the coating and the high temperature equipment for curing, causing some resin to flow or collapse, causing the sealing area to exceed the original design. In addition, this kind of defect not only affects the appearance of the product package, but also may cause interference with the metal or other shells installed later due to the area beyond the original design of the sealant, resulting in poor installation of the shell, or even failure to install , leading to product quality failure, or product scrapping, resulting in increased production costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0013] In the first aspect, the encapsulation resin material for chip protection used in encapsulation is UV photosensitive resin.

[0014] In the second aspect, when the encapsulation resin of the chip is extruded and coated on the chip, UV ultraviolet light is used for irradiation and curing.

[0015] Preferably, the UV ultraviolet light source can be fixed on the encapsulating resin extrusion equipment for resin extrusion, that is, for real-time curing under ultraviolet light irradiation, or can be irradiated on a separate UV ultraviolet light equipment for curing.

[0016] The methods provided in the embodiments of the present invention are for brief description, and for those not mentioned in the embodiments, reference may be made to the corresponding content in the foregoing product embodiments.

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PUM

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Abstract

The invention provides a novel rapid packaging method for a COB packaging integrated circuit. Through the method, the packaging of the sensor chips can be more efficiently carried out, the overall dimension precision of the packaging is obviously improved, the subsequent installation of an outer packaging shell is easy to carry out, the qualified rate is improved, and the cost waste caused by packaging is reduced.

Description

technical field [0001] The invention belongs to the field of integrated circuit semiconductor packaging, and relates to a novel rapid packaging method for COB packaging integrated circuits. Background technique [0002] At present, the traditional sensor chip packaging of fingerprint identification uses COB packaging in order to improve the sensitivity of identification. The packaging resin is silica gel, which is coated with glue on bare wafers or wire bonding, and then sent to high-temperature equipment for heating and curing. If further protection is required after curing, then the cured product is sealed and covered with a metal or other casing. [0003] In this process, during the resin coating process, after the coating is completed, there is a delay in the middle of sending it to the high-temperature equipment for curing, causing some resin to flow or collapse, causing the sealing area to exceed the original design. In addition, this kind of defect not only affects t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/29B05C9/12B05D3/06G06K9/00
CPCH01L21/56H01L23/293B05C9/12B05D3/067G06V40/12
Inventor 夏乾华
Owner 鑫金微半导体(深圳)有限公司
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