A road structure compressive strain monitoring sensor, manufacturing method and device

A technology for monitoring sensors and manufacturing methods, applied in measuring devices, electromagnetic measuring devices, electric/magnetic solid deformation measurement, etc., can solve problems such as unstable contact electrical signals, complex production process, low production efficiency, etc., and achieve significant economic benefits Harmony with society, easy availability of manufacturing materials, and simple manufacturing process

Active Publication Date: 2022-07-26
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This has the disadvantages that the surface integrity of the sample may not be smooth enough, the conductive adhesive has a long curing time period, the conductive adhesive has poor adhesion, and the contact electrical signal is unstable; and the production process is complicated and the production efficiency is low.

Method used

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  • A road structure compressive strain monitoring sensor, manufacturing method and device
  • A road structure compressive strain monitoring sensor, manufacturing method and device
  • A road structure compressive strain monitoring sensor, manufacturing method and device

Examples

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Embodiment 1

[0033] like figure 1 As shown, the present disclosure provides a method for manufacturing a road structure compressive strain monitoring sensor, the steps comprising:

[0034] Prepare an integrated molding mold, inject conductive composite sensitive materials, and obtain conductive core components after molding and curing;

[0035] Assemble the conductive core components to form a casting mold, pour high temperature resistant materials, and obtain high temperature resistant conductive core components after molding and curing;

[0036] The high temperature-resistant conductive core element is assembled into a compressive strain sensor packaging mold, the packaging material is injected, and the road structure compressive strain monitoring sensor is obtained after molding and curing.

[0037] Further, the high temperature resistant material is epoxy resin, and the pouring mold is an epoxy column pouring mold. The upper and lower ends of the epoxy column pouring mold are respecti...

Embodiment 2

[0049] The present disclosure provides a method for manufacturing a small compressive strain and compressive stress monitoring sensor of a road structure, including:

[0050] (1) Cut a silicone tube with a length of 5cm and an inner diameter of 1cm, and clean the inside. Punch holes at the corresponding positions of the silicone tube, and insert the pre-embedded wires with the protective sheaths at both ends removed into the holes.

[0051] (2) Insert the lower end into the cap plug and the upper end outflow cap plug into the silicone tube respectively, wherein the diameter of the cap plug is consistent with the inner diameter of the silicone tube. Insert the lower end injection conduit into the hole reserved on one side of the lower end injection cap plug, and insert the upper end outflow conduit into the hole reserved on the side of the upper end outflow cap plug. The wire should fit snugly with the cap plugs at both ends.

[0052] (3) Use vacuum sealant to seal the hole f...

Embodiment 3

[0060] The present disclosure provides a road structure compressive strain monitoring sensor, which is manufactured by the method for manufacturing a road structure compressive strain monitoring sensor as described in the above embodiments, including a conductive composite sensitive material core element, an epoxy column and an outer package layer, The top and bottom of the core element of the conductive composite sensitive material are installed with epoxy columns, and the side surface of the conductive composite sensitive material is wrapped with an outer packaging layer.

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Abstract

The present disclosure provides a road structure compressive strain monitoring sensor, a manufacturing method and a device. The steps include: preparing an integrated molding mold, injecting a conductive composite sensitive material, forming and curing to obtain a conductive core element; assembling the conductive core element to form a casting mold, The high temperature resistant material is poured, and the high temperature resistant conductive core element is obtained after molding and curing; the high temperature resistant conductive core element is assembled into a compressive strain sensor packaging mold, the packaging material is injected, and the road structure compressive strain monitoring sensor is obtained after molding and curing; The compressive strain and compressive stress monitoring sensor manufacturing device and method, when manufacturing the sensor, the sensor manufacturing process is simple, the manufacturing materials are easy to obtain, and the simple preparation of the core components of the sensor, the conductive circuit and the packaging material can be effectively realized; its stiffness is related to the road surface. The stiffness of the structural layer is matched, the service life is long, and the survival rate is high.

Description

technical field [0001] The present disclosure relates to the fields of road engineering materials and road engineering monitoring, in particular to a manufacturing device and method for a micro-compression-strain monitoring sensor with a strain and stress resistance response sensitive conductive composite sensitive material as a core element. Background technique [0002] The statements in this section merely provide background information related to the present disclosure and do not necessarily constitute prior art. [0003] In recent years, conductive composite sensitive materials have provided new ideas for intelligent monitoring. The application of conductive composite sensitive materials in engineering fields such as roads, bridges, aerospace, civil engineering, electronics, electrical, petrochemical and other engineering fields has broad prospects. However, in practical engineering applications, conductive composite sensitive materials need to face a variety of comple...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C39/02B29C39/26G01B7/16G01L1/00B29K63/00
CPCB29C39/021B29C39/26G01B7/16G01L1/005B29K2063/00B29L2031/752
Inventor 梁明辛雪苏林萍姚占勇仇正梅蒋红光张吉哲姚凯
Owner SHANDONG UNIV
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