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Substrate processing apparatus and substrate processing method

A technology of a substrate processing device and a substrate processing method, which is applied in the directions of transportation and packaging, conveyor objects, electrical components, etc., can solve the problems of wafer damage, bending of heterogeneous crystal sheets, etc.

Pending Publication Date: 2021-06-25
SUBARU TECNICA INTERNATIONAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Heterogeneous crystalline wafers are subject to thermal deformation such as warping caused by heat when heated, and there is a problem of wafer damage

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

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Experimental program
Comparison scheme
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Embodiment Construction

[0039] The present invention will be described in detail below with reference to the accompanying drawings.

[0040] refer to Figure 1 to Figure 4 A first embodiment of the substrate processing apparatus according to the present invention will be described.

[0041] The substrate processing apparatus 100 according to the present invention includes: a chamber 190 in which a heat treatment space S of a substrate W is arranged; a heating unit 120 provided on an upper portion of the chamber 190 to heat the substrate W; a substrate supporting unit 150 provided in the inside of the chamber 190 to place the substrate W; the blocking member 110-1, when loading the substrate W into the chamber 190 or unloading the substrate W inside the chamber 190 to the outside Below, it is located at a blocking position that blocks the heat transfer from the heating portion 120 to the substrate W by blocking the space between the heating portion 120 and the substrate W.

[0042] A control unit fo...

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PUM

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Abstract

The purpose of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of minimizing thermal deformation of a substrate by blocking between the substrate and a heating unit inside a chamber when loading and unloading the substrate. In order to implement the same, the substrate processing apparatus of the present invention comprises: a chamber in which a heat treatment space for a substrate is arranged; a heating unit provided on the upper portion of the chamber to heat the substrate; a substrate support part which is provided inside the chamber and on which the substrate is placed; and a blocking member located at a blocking position that blocks a space between the heating portion and the substrate and blocks heat transfer of the heating portion to the substrate when the substrate is loaded into the chamber or the substrate inside the chamber is unloaded to the outside.

Description

technical field [0001] The present invention relates to a substrate processing apparatus and a substrate processing method, and in more detail, relates to a substrate processing apparatus and a substrate processing method capable of blocking the substrate from a heating portion inside a chamber to minimize thermal deformation of the substrate when loading or unloading a substrate . Background technique [0002] Generally, a reflow process, which is a post-process of semiconductors, is a process of supplying solder to be soldered to a semiconductor wafer or a PCB, and heating the solder to electrically connect electronic components or wiring. In order to perform the reflow process, it is necessary to perform heat treatment of heating solder and heat treatment of cooling after heating, and such heat treatment devices are manufactured in various structures according to manufacturers. [0003] As a prior art related to the heat treatment apparatus as described above, there is K...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67098H01L21/67011H01L21/67739H01L24/13H01L24/16H01L24/11
Inventor 孙侐主朴永秀崔宇镇金永镐吴俊昊许东根李民荣
Owner SUBARU TECNICA INTERNATIONAL