PCB board and components

Abstract

The present application relates to the technical field of electronic products, in particular to PCB boards and components. The PCB board includes a PCB pad and a substrate layer, the PCB pad includes a plurality of sub-pads arranged at a gap, and a gap channel is enclosed between adjacent sub-pads; the substrate layer includes a first surface and a second surface arranged opposite to each other. Surface, the first surface is provided with a first fixing area for fixing a plurality of sub-pads; wherein, the PCB board is provided with a via hole penetrating the sub-pad and the base material layer, and the via hole is arranged adjacent to the gap channel to be used for sub-soldering. The heat of the disc is conducted into the second surface and into the interstitial channel. The component includes a PCB board, a component body and a solder layer, the component body includes a component pad, and the solder layer is located between the component pad and the sub-pad, and then conducts the heat of the PCB pad to the second surface and the gap channel through the hole . Through the above method, the gas can be discharged from the gap channel, and the welding quality is improved; and heat exchange occurs between the gap channel and the inner wall of the third via hole, and the heat conduction efficiency of the third via hole is improved.

Description

Technical field [0001] This application involves the field of electronic product technology, which is specifically involved in PCB boards and components. Background technique [0002] Components with heat dissipation pads are often used in circuit design. Such components usually have high power consumption and large heat dissipation. When the temperature exceeds the range of the meta component, the work efficiency of the component will be reduced and even damaged. Invention content [0003] This application provides a PCB board and component. [0004] This application provides a PCB board, including: [0005] PCB pads, including sub -pads set by multiple gaps, surrounded meter channels between adjacent sub -pads; and [0006] The substrate layer, including the first and second surface set by the back settings, the first surface of the first surface is used to fix the first fixed area for multiple sub -pads; [0007] Among them, the PCB board is opened with a perforated pores tha...

AI Technical Summary

Problems solved by technology

[0002] Components with heat dissipation pads are often used in circuit design. Such components usually have high power consumption and large heat dissipation. The printed circuit board (PCB, Printed Circuit Board) of this component needs to be designed for heat dissipation, otherwise When the temperature exceeds the tolerance range of the components, the working efficiency of the components will be reduced or even damaged

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