Polyamic acid composition, polyimide composition, polyimide film and polyimide copper-clad plate
A polyimide film and polyamic acid technology, applied in the field of functional polymers, can solve the problem of low bonding force between polyimide and copper, and achieve the effect of solving the low bonding force and improving the bonding force
Active Publication Date: 2021-07-02
SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS
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Problems solved by technology
[0005] The present invention aims at the deficiencies of the above-mentioned prior art, and provides a polyamic acid composition, a polyimide composition prepared by using the polyamic acid composition, and a polyimide composition prepared by using the polyamic acid composition. Amine film and polyimide copper clad laminate to solve the problem of low bonding force between polyimide and copper used in the rewiring layer in the prior art
Method used
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Embodiment 1
[0035] Add 0.2g of 2,4-diamino-6-hydroxypyrimidine to the above-mentioned polymer A glue, stir in an ice-water bath for 6 hours to obtain glue A, and evenly coat glue A with a roughness of less than 0.1 μm copper foil, and then thermally imidized in a temperature-programmed oven at 350°C under a nitrogen atmosphere to obtain a polyimide film.
Embodiment 2
[0037] Add 0.2g of 4,6-dihydroxypyrimidine to the above-mentioned polymer A glue, stir in an ice-water bath for 6 hours to obtain glue B, and evenly coat glue B on a copper foil with a roughness less than 0.1μm by spin coating Then heat imidization in a temperature-programmed oven at 350°C under a nitrogen atmosphere to obtain a polyimide film.
Embodiment 3
[0039] Add 0.2 g of 2-aminopyridine to the above-mentioned polymer A glue, and stir in an ice-water bath for 6 hours to obtain glue C, which is uniformly coated on a copper foil with a roughness of less than 0.1 μm by a spin coating process, Then thermally imidize in a temperature-programmed oven at 350° C. under a nitrogen atmosphere to obtain a polyimide film.
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The invention relates to the technical field of functional polymers, and in particular, relates to a polyamic acid composition and a preparation method thereof. The polyamic acid composition comprises polyamic acid and a bonding additive, the bonding additive is selected from at least one of a pyridine derivative and a pyrimidine derivative, the pyridine ring of the pyridine derivative is optionally monosubstituted or polysubstituted by -NH2, -OH and -CH2OH, and the pyridine ring of the pyrimidine derivative is optionally monosubstituted or polysubstituted by -NH2 and -OH. The polyamide acid composition is prepared by adding the pyridine derivative or the pyrimidine derivative as a bonding aid, and the polyimide composition, a polyimide film and a polyimide copper-clad plate which are prepared by applying the polyamide acid composition and have high bonding strength are provided, so that the bonding force of polyimide and a copper surface is remarkably improved, the polyimide can be used as an interlayer dielectric material in wafer-level fan-out type packaging or large-board-level fan-out type packaging of high-frequency communication, and thus the problem of low binding force between a current polyamide acid glue solution for a rewiring layer and copper is solved.
Description
technical field [0001] The invention relates to the technical field of functional polymers, in particular to a polyamic acid composition, a polyimide composition prepared by using the polyamic acid composition, and a polyimide composition prepared by using the polyamic acid composition. Amine films and polyimide copper clad laminates for wafer-level packaging that improve copper adhesion. Background technique [0002] Polyimide material has excellent electrical, mechanical, and thermal properties, and it plays a role in protecting chips and metal lines in rewiring technology, preventing them from physical, chemical, and electrical damage (such as stress buffering, flattening wafers, etc.) chemical, copper protection, etc.). Generally, polyimide is formed by first reacting polyamic acid composition to form polyamic acid, which is then coated on copper foil and subjected to imidization reaction. However, in order to apply polyimide materials, it is necessary to solve the pro...
Claims
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Patent Timeline
Login to View More IPC IPC(8): C08L79/08C08K5/3462H01L23/498C08G73/10C08J5/18
CPCC08G73/1071C08G73/1007C08J5/18H01L23/49894C08J2379/08C08K5/3462
Inventor 李盈盈李金辉李长青张国平
Owner SHENZHEN INST OF ADVANCED ELECTRONICS MATERIALS