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A composite structure surface in the field of enhanced radiative cooling

A composite structure, radiation refrigeration technology, applied in refrigerators, refrigeration and liquefaction, chemical instruments and methods, etc., can solve the problems of poor spectral radiation characteristics, complex surface design of radiation structures, etc., and achieve the effect of simple design

Active Publication Date: 2022-04-12
DALIAN UNIV OF TECH
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Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of complex radiation structure surface design and poor spectral radiation characteristics, and propose a composite structure surface based on titanium-germanium-tungsten

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  • A composite structure surface in the field of enhanced radiative cooling
  • A composite structure surface in the field of enhanced radiative cooling
  • A composite structure surface in the field of enhanced radiative cooling

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Embodiment Construction

[0016] The present invention is based on the range of 50-100°C. Considering that the thermal radiation is mainly concentrated in the near-middle infrared region, a composite structure surface based on titanium-germanium-tungsten is proposed.

[0017] The thickness L8 of the metal tungsten substrate is 2-2.5 μm, the semiconductor germanium dielectric layer L7 is 0.6-0.8 μm; the length L3 of the titanium metal strip is 1-1.2 μm, the width L4 is 0.2-0.25 μm, and the height L9 is 0.06-0.08μm; vertical and parallel titanium metal strips are staggered; the distance between parallel titanium metal strips in the parallel direction L2 is 1μm, and the distance between vertical titanium metal strips in the parallel direction is L3+2L1 is 1.8-2μm; the vertical titanium metal strips are in the vertical direction The distance L6 is 1 μm, and the distance L3+2L5 in the vertical direction of the parallel titanium strips is 1.8-2 μm.

[0018] In the titanium-germanium-tungsten micro-nano comp...

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Abstract

The invention belongs to the technical field of radiation refrigeration, and proposes a composite structure surface in the field of enhanced radiation refrigeration. The surface is based on the material stacking sequence of titanium-germanium-tungsten, where titanium metal needs to be dimensionally designed and prepared with metal strips with length, width and thickness of 1 μm, 0.2 μm and 0.06 μm respectively placed on the tungsten substrate and the dielectric On the germanium layer, these metal strips are distributed alternately in parallel and vertical directions, and the spacing between adjacent and parallel strips is set to 1 μm. The germanium dielectric layer in the middle is set to 0.6 μm, and the metal tungsten is set as the metal substrate, and its thickness is set to 2 μm. The invention has the characteristics of strong preparation feasibility and outstanding radiation characteristics, and the surface can have higher spectral emissivity in the atmospheric window band, meeting the requirements of radiation refrigeration.

Description

technical field [0001] The invention belongs to the technical field of radiation refrigeration, and relates to a composite structure surface in the field of enhanced radiation refrigeration. Background technique [0002] The atmosphere has a very high transmission performance for some special wave bands, such as electromagnetic waves in the range of 8-13 μm, so that electromagnetic waves can directly radiate into space, so this wave band is called the atmospheric window. According to the thermodynamic application value of the atmospheric window, radiation cooling is proposed as a passive heat dissipation method. Its purpose is to strengthen the radiation of electromagnetic waves with wavelengths in the 8-13 μm spectral range and suppress the emission of electromagnetic waves outside this range. The metamaterial electromagnetic transmitter can make the surface have high emissivity characteristics in the atmospheric window band through microscopic regulation, so as to meet the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B23/00B32B15/01B32B3/08
CPCF25B23/003B32B15/01B32B3/085B32B2255/06B32B2255/205B32B2307/20
Inventor 崔贵成吕继组高林松白敏丽
Owner DALIAN UNIV OF TECH
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