Automatic feeding and discharging high-speed chip mounter

Abstract

The invention discloses an automatic feeding and discharging high-speed chip mounter which comprises a workbench, a first box body is installed on the left side of the top of the workbench, a chip mounter is installed on the right side of the top of the workbench, and a chip pushing assembly is arranged on the left side of the top of the workbench. Through the rotary connection relation between a second short handle and a third short handle, the fixed relation between a vertical block and a square block, and empty grooves processed in the front and rear end faces of a second box body, the vertical block shifts a bonding pad to enable the bonding pad to leave the second box body, so that a chip mounter is matched with the bonding pad at the same time, the chip mounter better carries out chip mounting on the bonding pad, the control is convenient, a second short rod is rotationally connected with an elliptical plate, and a sixth short rod is rotationally connected with a first cross rod through a short seat, so that the elliptical plate is driven by a second motor to enable a second cross rod to operate along an elliptical track, and then the bonding pad plate is continuously fed for equal time through a sliding rail.

Description

technical field [0001] The invention relates to the technical field of automatic feeding and discharging high-speed placement machines, in particular to an automatic feeding and discharging high-speed placement machines. Background technique [0002] The placement machine is also called "mounting machine" and "surface mount system". In the production line, it is configured after the dispensing machine or screen printing machine, and the surface mount components are accurately placed on the PCB by moving the placement head. A device on the pad is divided into two types: manual and fully automatic, so a high-speed placement machine with automatic feeding and discharging is needed. [0003] The automatic feeding and discharging high-speed placement machine in the prior art, its feeding device cannot cooperate with the placement machine, and feeds materials into the placement machine, resulting in a poor effect of simultaneous cooperation between the placement machine and the pa...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-speed chip mounter with automatic feeding and discharging, so as to solve the problem that its feeding device cannot cooperate with the chip mounter in the above-mentioned background technology, and feeds materials into the chip mounter, causing the chip mounter and the pad The problem of poor coordination at the same time

Images