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Test methods for performance parameters of glue

A testing method and performance technology, applied in the testing field of glue performance parameters, can solve the problems of inability to directly measure, difficult to provide DK and DF, expensive testing instruments, etc., achieve small consistency error, improve testing accuracy, and high processing accuracy Effect

Active Publication Date: 2022-05-24
SHENZHEN SUNWAY COMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As for the dielectric constant (DK) and dielectric loss (DF) of glue at different frequencies, glue manufacturers usually only provide DK and DF at extremely low frequencies such as 10KHz. For the millimeter wave frequency band, on the one hand, the test equipment is expensive. On the other hand, the glue will stick to the measuring instrument and cannot be directly measured. These factors make it difficult for manufacturers to provide DK and DF when the glue works in the millimeter wave frequency band.

Method used

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  • Test methods for performance parameters of glue
  • Test methods for performance parameters of glue

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Embodiment 1

[0054] Please refer to figure 1 and figure 2 , Embodiment one of the present invention is: the test method of glue performance parameter, comprises the following steps,

[0055]Obtain the sample to be tested, the sample to be tested includes the antenna formation layer 1, the adhesive layer 2 to be tested, the PCB board dielectric layer 3 and the circuit layer 4 sequentially stacked from bottom to top; the circuit layer 4 includes a resonant ring 41, a microstrip line 42 and a radio frequency connector 43, the two ends of the microstrip line 42 are respectively connected to the resonant ring 41 and the radio frequency connector 43, specifically, the number of the microstrip line 42 is two, and the two microstrip lines 42 Collinear setting, the resonant ring 41 is located between the two microstrip lines 42; the thickness of the adhesive layer 2 to be tested is equal to the thickness of the PCB dielectric layer 3, preferably, the PCB dielectric The thickness of layer 3 is 0....

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Abstract

The invention discloses a method for testing performance parameters of glue, which comprises the following steps of obtaining a sample to be tested, the sample to be tested includes an antenna ground layer, a glue layer to be tested, a PCB board medium layer and a circuit layer stacked sequentially from bottom to top, and the The line layer includes a resonant ring, and the thickness of the adhesive layer to be measured is equal to the thickness of the PCB dielectric layer; the average dielectric constant DK_ave of the adhesive layer to be measured and the dielectric layer of the PCB is calculated according to the calculation formula; calculated according to the calculation formula Obtain the dielectric constant DK of the adhesive layer to be tested. The test method can test the performance parameters of the glue at low cost, especially the performance parameters of the glue in the millimeter wave frequency band.

Description

technical field [0001] The invention relates to a test method for glue performance parameters. Background technique [0002] For the 5G millimeter-wave antenna module, the industry chooses to combine the RF chip and the substrate antenna to form an AIP (antenna-in-package) to reduce the RF system loss, and this has higher integration and better performance. The AIP composed of the dielectric resonator antenna module is an excellent solution because the number of PCB layers required is greatly reduced compared with the number of substrate layers of the previous AIP, and the processing accuracy is high and the cost is low. [0003] However, the dielectric resonator antenna still needs to be integrated with 2-3 layers of PCB boards for matching and interconnection. Usually, the PCB boards are connected and fixed by glue. As for the dielectric constant (DK) and dielectric loss (DF) of glue at different frequencies, glue manufacturers usually only provide DK and DF at extremely ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R27/26
CPCG01R27/2617G01R27/2694
Inventor 赵伟侯张聚唐小兰戴令亮谢昱乾
Owner SHENZHEN SUNWAY COMM
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