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IGBT module internal chip junction temperature measuring system and method, and IGBT module

A module internal and measurement system technology, applied in the direction of measuring heat, measuring electrical variables, measuring electricity, etc., can solve the problems of increasing chip manufacturing cost, increasing cost and system complexity, etc., achieving low cost, simple structure and accurate temperature measurement Effect

Pending Publication Date: 2021-07-09
GAC AION NEW ENERGY AUTOMOBILE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method measures temperature accurately, but it needs to integrate an additional temperature measuring diode inside the original chip, which increases the cost of chip manufacturing.
Not only that, since the temperature measuring diode and the module chip are also at the high-voltage electrical end, the temperature signal needs to be isolated by a special signal isolation sampling circuit before it can be transmitted to the control circuit at the low-voltage end, which will increase the cost and system complexity

Method used

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  • IGBT module internal chip junction temperature measuring system and method, and IGBT module
  • IGBT module internal chip junction temperature measuring system and method, and IGBT module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] refer to figure 1 , the present embodiment provides a system for measuring the internal chip junction temperature of the IGBT module, including a temperature measuring device and a convex lens 2 arranged above the internal chip 1 of the IGBT module 5, the temperature measuring device includes a temperature sensing device 3 and a temperature measuring circuit, The temperature sensing device 3 is connected to the temperature measuring circuit, and the temperature sensing device 3 is arranged above the convex lens 2 and located at the focal point of the convex lens 2 .

[0031] In this embodiment, the convex lens 2 is embedded on the outer surface of the IGBT module 5 , and one side of the convex lens 2 faces the chip 1 ; the other side is exposed outside the IGBT module 5 . The main optical axis of the convex lens 2 is perpendicular to the surface of the chip 1 . The temperature measuring device further includes a PCB board 4 on which the temperature sensing device 3 and...

Embodiment 2

[0036] refer to figure 1 , the present embodiment provides a method for measuring the internal chip junction temperature of the IGBT module by using the IGBT module internal chip junction temperature measurement system described in Embodiment 1, comprising the following steps:

[0037] First, the convex lens 2 is arranged above the internal chip 1 of the IGBT module 5;

[0038] Then, the temperature measuring device is arranged above the convex lens 2, and the temperature sensing device 3 of the temperature measuring device is located at the focal point of the convex lens 2, and the convex lens 2 will collect the heat radiation of the chip 1 inside the IGBT module 5 , and focus on the temperature sensing device 3;

[0039] Finally, according to the corresponding relationship between the actual temperature of the chip 1 inside the IGBT module 5 and the temperature indicated by the temperature sensing device 3, the temperature value of the chip inside the IGBT module is obtaine...

Embodiment 3

[0045] refer to figure 1 , according to the measurement system described in Embodiment 1 and the measurement method described in Embodiment 2, this embodiment provides an IGBT module, the outer surface of the IGBT module is embedded with a convex lens 2, and the convex lens 2 is arranged on the IGBT module 5 above the internal chip 1, and one side of the convex lens 2 faces the chip 1; the other side is exposed outside the IGBT module 5.

[0046] Utilizing the IGBT module described in this embodiment is beneficial to the real-time measurement of the chip temperature using the test system of the first embodiment of the present invention and the test method of the second embodiment, and the internal chip of the IGBT module only needs to be provided with a temperature measuring device. temperature.

[0047] In this embodiment, the main optical axis of the convex lens 2 is perpendicular to the surface of the chip. This can improve the focusing efficiency of thermal radiation and...

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Abstract

The invention provides an IGBT module internal chip junction temperature measuring system and method, and an IGBT module. The measuring system comprises a temperature measuring device and a convex lens arranged above an internal chip of the IGBT module, the temperature measuring device comprises a temperature sensing device and a temperature measuring circuit, and the temperature sensing device is arranged above the convex lens and located at the focus of the convex lens. The temperature measuring method comprises the steps that the convex lens collects heat radiation of a chip in the IGBT module and focuses the heat radiation on the temperature sensing device; and the temperature value of the chip in the IGBT module is obtained according to the corresponding relation between the actual temperature of the chip and the indicated temperature of the temperature sensing device According to the measuring system, heat generated by the chip in the IGBT module is focused to the temperature sensing device through the convex lens on the basis of the radiation heat transfer principle, then the temperature of the temperature sensing device is measured through the temperature measurement circuit, the temperature of the chip in the IGBT module can be indirectly measured, and the system has the advantages of being simple in structure, low in cost, accurate in temperature measurement and the like.

Description

technical field [0001] The invention relates to chip temperature measurement, in particular to a chip junction temperature measurement system inside an IGBT module, a measurement method and an IGBT module Background technique [0002] On a general IGBT module, an IGBT chip and an anti-parallel diode (FWD) chip are integrated. These chips will pass a lot of current during work, and if the chip temperature is too high, the chip will burn out. Therefore, when the IGBT module is actually applied, it is necessary to closely monitor the chip temperature on the module. [0003] At present, during the operation of components, the methods for real-time measurement of the chip junction temperature inside the IGBT module include NTC thermistor method and diode temperature measurement. [0004] The NTC thermistor method is to install the NTC thermistor near the chip, measure the temperature near the chip through the NTC thermistor, and correct the temperature to obtain the internal ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01K13/00
CPCG01R31/2619G01K13/00
Inventor 夏铸亮梁灵威赵小坤王明亮陈平刘呈超
Owner GAC AION NEW ENERGY AUTOMOBILE CO LTD