IGBT module internal chip junction temperature measuring system and method, and IGBT module
A module internal and measurement system technology, applied in the direction of measuring heat, measuring electrical variables, measuring electricity, etc., can solve the problems of increasing chip manufacturing cost, increasing cost and system complexity, etc., achieving low cost, simple structure and accurate temperature measurement Effect
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Embodiment 1
[0030] refer to figure 1 , the present embodiment provides a system for measuring the internal chip junction temperature of the IGBT module, including a temperature measuring device and a convex lens 2 arranged above the internal chip 1 of the IGBT module 5, the temperature measuring device includes a temperature sensing device 3 and a temperature measuring circuit, The temperature sensing device 3 is connected to the temperature measuring circuit, and the temperature sensing device 3 is arranged above the convex lens 2 and located at the focal point of the convex lens 2 .
[0031] In this embodiment, the convex lens 2 is embedded on the outer surface of the IGBT module 5 , and one side of the convex lens 2 faces the chip 1 ; the other side is exposed outside the IGBT module 5 . The main optical axis of the convex lens 2 is perpendicular to the surface of the chip 1 . The temperature measuring device further includes a PCB board 4 on which the temperature sensing device 3 and...
Embodiment 2
[0036] refer to figure 1 , the present embodiment provides a method for measuring the internal chip junction temperature of the IGBT module by using the IGBT module internal chip junction temperature measurement system described in Embodiment 1, comprising the following steps:
[0037] First, the convex lens 2 is arranged above the internal chip 1 of the IGBT module 5;
[0038] Then, the temperature measuring device is arranged above the convex lens 2, and the temperature sensing device 3 of the temperature measuring device is located at the focal point of the convex lens 2, and the convex lens 2 will collect the heat radiation of the chip 1 inside the IGBT module 5 , and focus on the temperature sensing device 3;
[0039] Finally, according to the corresponding relationship between the actual temperature of the chip 1 inside the IGBT module 5 and the temperature indicated by the temperature sensing device 3, the temperature value of the chip inside the IGBT module is obtaine...
Embodiment 3
[0045] refer to figure 1 , according to the measurement system described in Embodiment 1 and the measurement method described in Embodiment 2, this embodiment provides an IGBT module, the outer surface of the IGBT module is embedded with a convex lens 2, and the convex lens 2 is arranged on the IGBT module 5 above the internal chip 1, and one side of the convex lens 2 faces the chip 1; the other side is exposed outside the IGBT module 5.
[0046] Utilizing the IGBT module described in this embodiment is beneficial to the real-time measurement of the chip temperature using the test system of the first embodiment of the present invention and the test method of the second embodiment, and the internal chip of the IGBT module only needs to be provided with a temperature measuring device. temperature.
[0047] In this embodiment, the main optical axis of the convex lens 2 is perpendicular to the surface of the chip. This can improve the focusing efficiency of thermal radiation and...
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