Method and equipment for eliminating bubbles in pipeline of photoresist coating equipment

A technology of bubble elimination and glue coating, which is applied in photoplate-making process coating equipment, electrical components, static electricity, etc., can solve the problems of bubble adsorption and accumulation, and achieve the goal of eliminating bubble adsorption and accumulation, prolonging working time and improving production efficiency. Effect

Pending Publication Date: 2021-07-09
HUA HONG SEMICON WUXI LTD
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0003] The technical problem to be solved by the present invention is how to alleviate the phenomenon of bubble adsorption and accumulation on the wall of the delivery pipeline or photoresist storage container, so that the bubbles can be automatically discharged by the bubble removal equipment, reduce manual intervention, and improve production efficiency

Method used

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  • Method and equipment for eliminating bubbles in pipeline of photoresist coating equipment
  • Method and equipment for eliminating bubbles in pipeline of photoresist coating equipment

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Embodiment Construction

[0022] Before describing the specific embodiment of the present invention in detail, it needs to be further explained. It is found that the reason why the bubbles will be adsorbed on the pipe wall of the pipeline or the wall of the photoresist storage container is caused by static electricity and has not been disclosed by the prior art. Therefore, it is explained It is not obvious that this reason can be found, and it is not difficult to manage subsequent verification.

[0023] figure 1 It is a flow chart of the pipeline bubble elimination method of the photoresist coating equipment of the present invention

[0024] Step S1, making the photoresist coating equipment work for a preset time;

[0025] The purpose is to make the photoresist flow in the tubing. During the flow of the photoresist, the friction between the fluids and the friction between the fluid and the pipe wall and the side wall of the storage container will result in the generation of static electricity, which ...

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Abstract

The invention discloses a method for eliminating bubbles in a pipeline of photoresist coating equipment. The method comprises the following steps: S1, enabling the photoresist coating equipment to work for a preset time; S2, positioning a static electricity gathering part, wherein the static electricity gathering part is positioned on the surface of the photoresist conveying pipeline and / or the surface of the photoresist storage container; and S3, installing a static electricity elimination device, wherein the static electricity elimination device comprises at least one conductive device, one end of the conductive device being pasted to the static electricity gathering part, and the other end of the conductive device being fixed to a grounding point of the shell of the photoresist coating equipment.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, in particular to a method and equipment for eliminating bubbles in pipelines of photoresist coating equipment. Background technique [0002] In the manufacturing process of semiconductor integrated circuits, photoresist coating equipment needs to be frequently used, and the air bubbles in the photoresist will affect the coating quality of the photoresist. Therefore, the prior art has disclosed methods for eliminating air bubbles in photoresist coating equipment. For example, a vacuum device is used to discharge air bubbles in the photoresist delivery pipeline, such as public documents CN110083016A, CN110787967A, CN111897187A, CN210675762U, etc. But in some cases, the bubbles will be adsorbed on the wall of the pipeline or the wall of the photoresist storage container, and it is not easy to discharge, especially the characteristics of some photoresists make it easy to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/16H05F3/02
CPCG03F7/16H05F3/02
Inventor 马健超李华闻旭赵春雨葛斌吴长明
Owner HUA HONG SEMICON WUXI LTD
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