Technical process film for laminating UV-irradiation viscosity reduction type OLED module and preparation method of technical process film

Abstract

The invention discloses a technical process film for laminating a UV-irradiation viscosity reduction type OLED module and a preparation method of the technical process film. The technical process filmcomprises an anti-adsorption conductive layer A, a base material, a pressure-sensitive glue layer, a release film and an anti-adsorption conductive layer B, wherein one surface of the base material is coated with the anti-adsorption conductive layer, a corona surface and the release film on the other surface are laminated through the pressure-sensitive glue layer, the pressure-sensitive glue layer is a UV light-reducing viscose layer and has anti-static performance, and the back surface of the release film is coated with the anti-adsorption conductive layer. According to the technical processfilm disclosed by the invention, the anti-static requirement on the film surface and the back surface of the release film is increased based on an anti-static glue surface, the situation of electrostatic adsorption is avoided in the pick-up and use processes of a film piece, and the stability of the technical process is improved; and the technical process film is mainly applied to the laminationof OLED screen modules.

Description

technical field [0001] The invention relates to the field of adhesive tapes, in particular to a process film for bonding OLED modules and a preparation method thereof. Background technique [0002] 0LED, Organic Light-Emitting Diode (Organic Light-Emitting Diode), also known as Organic Electroluminescence Display (Organic Electroluminescence Display), refers to organic semiconductor materials and light-emitting materials that are driven by an electric field to cause light emission through carrier injection and recombination. The phenomenon. Panels using OLED are inherently superior to thin-film transistor liquid crystal displays (TFT-1XD) in terms of image quality, performance, and cost. However, the life cycle of general OLED is easily affected by the surrounding water vapor and oxygen, so the AM-OLED panel needs good packaging to isolate the surrounding water vapor and oxygen. [0003] Process film is required in the packaging and bonding process of OLED modules. General...

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the purpose of the present invention is to provide a process film for bonding OLED modules, which can effectively solve the problem of dust adsorption generated during the tearing off process of the supporting surface. And screen breakdown and other problems, and at the same time eliminate the adsorption phenomenon in the process of taking the film

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